Tdk Corporation

Daisuke Iwanaga

Yukie Nakano

Toshio Sakurai

Hirobumi Tanaka

Keisuke Okai

Hisashi Nakata

Mari Miyauchi

Tomoya Shibasaki

Shunichi Yuri

Atsushi Iijima

Akifumi Kamijima

Takeshi Nomura

Katsuto Nagano

Suguru Takayama

Kazushige Ito

Kyung-Ku Choi

Taku Takeishi

Takako Hibi

Katsunori Osanai

Akira Sato

Masakazu Hosono

Tomoya Sihbasaki

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

Multi-layer ceramic electronic device

A magnetically actuated MEMS switchincludes a first magnetic core portion, a first signal line, a first contact point, a second magnetic core portion, a second signal line, a second contact point, and a first coil portionand a second coil portionserving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portionand the second magnetic core portion. The first contact pointis displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact pointand the second contact pointare switched in response to displacement of the first contact point

Magnetically actuated MEMS switch

A multi-layer ceramic electronic device includes an element body and terminal electrodes. The terminal electrodes include end electrode parts covering ends of the element body in which internal electrode layers are led and upper electrode parts continuing to the end electrode parts and each partially covering an upper surface of the element body in a lamination direction. An upper-surface cover layer covering the upper surface of the element body located between the upper electrode parts has an external surface substantially flush with external surfaces of the upper electrode parts. The terminal electrodes are not substantially formed on a lower surface of the element body located opposite to the upper surface of the element body in the lamination direction.

A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.

Multilayer ceramic electronic component and method of manufacturing the same

A multilayer ceramic electronic component includes an element body and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The terminal electrode is formed on an outer surface of the element body to be contacted and connected with the internal electrode layers. The terminal electrode includes an end-side electrode part and an upper-side electrode part. The end-side electrode part covers a leading end of the element body where the internal electrode layers are led. The upper-side electrode part is formed on a part of an upper surface of the element body and continues to the end-side electrode part. The terminal electrode is not substantially formed on a lower surface of the element body located on the other side of the upper surface along the lamination direction.

Multilayer ceramic electronic component

A ceramic electronic device having a dielectric layer, wherein the dielectric layer includes a main component containing a (Ba, Ca (Ti, Zr)Obased material and a subcomponent containing an oxide of Si; and a content of the Si oxide is 0 to 0.4 wt % (note that 0 is not included) with respect to the entire dielectric layer; and preferably the dielectric layer has a segregation phase; and the segregation phase contains an oxide of Si and substantially not containing an oxide of Li; by which it is possible to provide a ceramic electronic device, such as a multilayer ceramic capacitor, having a low IR defect rate (initial insulation resistance defect rate), excellent high temperature load lifetime and high reliability.

Ceramic electronic device and the production method

A method of producing a multilayer ceramic capacitor having internal electrode layers and dielectric layers with dielectric particles is disclosed. An average particle diameter of the dielectric particles, when measured parallel with the direction of the internal electrode layers, is larger than a thickness of the dielectric layer. A ratio (R/d) between the average particle diameter (R) and the thickness (d) of the dielectric layer is 1&#x3c;R/d&#x3c;3.

Method of making a multilayer ceramic capacitor

A laminated ceramic capacitor including a capacitor body where internal electrodes and a dielectric layer are alternately laminated, and external electrodes are provided on the end faces thereof. In this capacitor body, high resistance layers are provided between the internal electrodes and dielectric layer. These high resistance layers contain a ceramic material, an element including at least one selected from Mn, Cr, Co, Fe, Cu, Ni, Mo and V, and/or a rare earth element.

Laminated ceramic capacitor

The capacitor(laminated ceramic capacitor) of the invention comprises a capacitor bodywherein internal electrodes(electrodes) and a dielectric layerare alternately laminated, and external electrodesare provided on the end faces thereof. The dielectric layerhas a site containing particles of a dielectric material which is formed of only one of these particles in its thickness direction. Regionscomprising at least one element selected from a group comprising Si, Li and B are scattered between the internal electrodesand dielectric layer

In order to provide dielectric ceramic composition having low IR defect rate and high relative dielectric constant even when the multilayer ceramic capacitor is made thinner, dielectric ceramic composition including a main component expressed by a composition formula {{BaCa}O}{TiZrMg}Oand subcomponents of Mn oxide, Y oxide, V oxide and Si oxide is provided. In the above formula, A, B, x, y and z are as follows: 0.995&#x2266;A/B&#x2266;1.020, 0.0001&#x2266;x&#x2266;0.07, preferably 0.001&#x2266;x&#x3c;0.05, 0.1&#x2266;y&#x2266;0.3 and 0.0005&#x2266;z&#x2266;0.01, preferably 0.003&#x2266;z&#x2266;0.01.

Dielectric ceramic compositions and electronic devices

A multilayer ceramic capacitor having internal electrode layers and dielectric layers with dielectric particles is disclosed. An average particle diameter of the dielectric particles, when measured parallel with the direction of the internal electrode layers, is larger than a thickness of the dielectric layer. A ratio (R/d) between the average particle diameter (R) and the thickness (d) of the dielectric layer is 1<R/d<3.

Multilayer ceramic capacitor and production method thereof

A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality when used therein; a thin-film EL device using the substrate; and a production process for the device. The thin-film EL device is produced by forming a luminescent layer, other insulating layer and other electrode layer successively on a composite substrate comprising a substrate; an electrode layer embedded in the substrate in such a manner that the electrode layer and the substrate are in one plane; and an insulating layer formed on the surface of a composite comprising the substrate and the electrode layer.

Process for producing a thin film EL device

The invention provides a multilayer ceramic capacitor capable of preventing the occurrence of cracks by inhibiting the multilayer capacitor from expanding in a stacking direction and a width direction. The multilayer ceramic capacitor includes a capacitor element ( ) in which dielectric layers ( and ) and internal electrodes ( ) are alternately stacked. The capacitor element ( ) is obtained by stacking and firing a dielectric paste layer and an internal electrode paste layer. An expansion coefficient x in the stacking direction lies between &minus;0.05i% and 0.05i% inclusive, where i denotes the number of dielectric layers ( ), preferably the expansion coefficient x is 0% or less, or more preferably the expansion coefficient x lies between &minus;10% and 0% inclusive. Preferably, an expansion coefficient y in the width direction lies between &minus;0.05i% and 0% inclusive. The expansion coefficients x and y can be controlled by adding a carbon material or a lithium-containing compound to the internal electrode paste layer, or by reducing a thickness of the dielectric layer ( ) located in an outermost portion. Thus, the occurrence of cracks is inhibited, and therefore a fraction defective is reduced.

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Tokyo, Japan

Daisuke Iwanaga