Taiyo Yuden Co., Ltd.

Yamada Corporation

Daisuke Iwai

Shinichi Sasaki

Fumi Mori

Hiroyuki Moteki

Atsuhiro Yanagisawa

Yoshinori Shibata

Eriko Numata

Kotaro Yamada

Takeshi Nosaki

Masumi Ishii

Michio Oshima

A ceramic electronic component includes: a ceramic body including main surfaces perpendicular to a first axis and end surfaces perpendicular to a second axis; and external electrodes covering the end surfaces and extending from the end surfaces to the main surfaces. The external electrode includes a surface layer portion including a Sn plating layer, and an inner layer portion including a Ni plating layer adjacent to the Sn plating layer and including rounded inner end portions on the main surfaces. In a cross-section perpendicular to a third axis, a ratio t/tis 0.4 or more, where tis a thickness in the first axis direction of a portion where an inclination of a tangent line of an outer surface of the inner end portion to each main surface is 45°, and tis a maximum thickness in the first axis direction of the inner layer portion on each main surface.

Ceramic electronic component and circuit board

A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a plurality of internal electrodes laminated in one axial direction, and an end surface extending along a plane parallel to the axial direction, at least part of the plurality of internal electrode being drawn from the end surface. The external electrode covers the end surface of the ceramic body. In a thermal desorption spectrum of water of the multi-layer ceramic electronic component by thermal desorption spectroscopy, a ratio P/Pof a detection intensity Pof a first peak in a range of 200° C. to 300° C. to a detection intensity Pof a second peak in a range of 550° C. to 800° C. is equal to or lower than 11.

Multi-layer ceramic electronic component and circuit board including the same

Diaphragm pump

A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and the internal electrode layers are alternately exposed to two end faces; and external electrodes formed on the two end faces; wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer including Mo; and 'M&#x2265;0.003185&#xd7;(Ew&#xd7;Et)&#x2212;is satisfied when 'Et' is a height from a bottom one of the internal electrode layers to a top one of the internal electrode layers, &#x201c;Ew' is a width of the internal electrode layers in a direction in which side faces of the multilayer chip face with each other, and &#x201c;M&#x201d; is a Mo concentration (atm %) with respect to a main component ceramic of a total of the multilayer chip and the pair of external electrodes.

Multilayer ceramic capacitor using molybdenum (Mo) ground layer and manufacturing method of the same

A multilayer ceramic capacitor includes: a ceramic multilayer structure having a structure in which each of ceramic dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the ceramic multilayer structure, a main phase of the plurality of ceramic dielectric layers having a perovskite structure that includes Ca and Zr and is expressed by a general formula ABO; and a pair of external electrodes that are formed on the two edge faces, wherein 300&#xd7;TE/TA&#x2212;12&#x2264;30 is satisfied when a volume TA is a length C&#xd7;a width C&#xd7;a thickness Cof the ceramic multilayer structure and a volume TE is a length E&#xd7;a width E&#xd7;a thickness E&#xd7;a stacked number of the plurality of internal electrode layers in a capacity region.

Multilayer ceramic capacitor, circuit substrate and manufacturing method of the same

Growing community of inventors

Takasaki, Japan

Daisuke Iwai