The Yokohama Rubber Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Daisuke Irii

Yoshihiro Inomata

Nobuo Suzuki

Kazuyuki Kabe

Noriaki Kuroda

Gou Kawaguchi

Shigeru Yamauchi

Takashi Satoh

Susumu Hatanaka

Michihiko Sugiura

Tetsuji Kawazura

Osamu Ozawa

Kazunori Ishikawa

Shuji Takahashi

Yuichi Hara

Jiro Watanabe

Yoshihiro Soeda

Yukio Maeda

Takashi Akiguchi

Katuhiro Tanaka

A golf ball whose core is covered with a cover, wherein the core is constituted of a rubber composition containing polybutadiene rubber and the cover is constituted of a resin composition composed of ionomer resin and diene rubber. A golf ball cover material composition composed of ionomer resin, diene rubber and non-staining antioxidant. A method of manufacturing a golf ball cover material composition constituted by mixing/kneading ionomer resin and diene rubber.

Golf ball, golf ball cover material composition and method of manufacturing the composition

A thermoplastic elastomer composition which, when used for the inner tube and/or outer cover of a hose, can improve the hose flexibility at an ordinary temperature and low temperature, oil resistance, and cold resistance and can reduce the production costs since it does not require a vulcanization step and a hose having said properties using this elastomer composition for its inner tube and/or outer cover and a process and apparatus for the production thereof.

Thermoplastic elastomer composition, process for the preparation there of, hose made by using the composition, and process for the production thereof

Thermoplastic elastomer composition, hose comprising thermoplastic

A covering material composition for a golf ball, which comprises an ionomer resin and a diene rubber, the diene rubber being dispersed in the ionomer resin. The covering material composition is produced by mixing the ionomer resin with the diene rubber to disperse the diene rubber in the ionomer resin.

Covering material composition for golf ball and process for producing

An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.

Method for packaging electronic parts and adhesive for use in said method

Growing community of inventors

Hiratsuka, Japan

Daisuke Irii