Fuji Electric Co., Ltd.

Daisuke Inoue

Shin Soyano

Yuki Inaba

A semiconductor device includes case resin having frame part defining space in which semiconductor chip is disposed and bottom part located under the frame portion; external connection terminal having external terminal partially embedded in the frame part, and internal terminal disposed on the bottom part to extend from the external terminal into the space; wire electrically connecting the semiconductor chip and the internal terminal; and sealing resin formed in the space to cover the semiconductor chip, the wire, and the internal terminal. The internal terminal has rectangular connecting portion, and step portions disposed at opposite ends of the connecting portion, respective portions of the upper surfaces of the step portions facing each other are covered with vibration controlling portions implemented by the case resin, and the sealing resin is filled in first grooves exposing other portions of the upper surfaces of the step portions.

Semiconductor device

Semiconductor module

A semiconductor device includes a semiconductor element on an insulated circuit board, a housing having a side wall surrounding the circuit board, a lead terminal including a lead part and a terminal part extending orthogonal to the lead part, the terminal part having a base portion adjacent to the lead part and being embedded in the side wall, the remaining portion of the terminal part being exposed from the side wall and being connected to the semiconductor element via a wiring member, and a sealing resin provided in the housing. The side wall has an anchor part formed in an inner surface at a position within an area where the lead part is embedded and above the terminal part, the anchor part including concave portions that are each defined by a pair of opposed surfaces parallel to each other and orthogonal to the upper surface of the insulation plate.

The semiconductor device includes a multi-layered substrate having an insulating plate and a circuit plate, a semiconductor chip having a front surface attached with a main electrode and a control electrode formed thereon, and a back surface fixed to the circuit plate, a first wiring substrate which includes a first conductive member and is placed so as to face the main electrode connected electrically to first conductive member, a second wiring substrate which includes a second conductive member, is placed so as to face the control electrode, and has an opening, and a conductive post having one end and another end, the one end being connected electrically and mechanically to the control electrode, and the other end being connected electrically and mechanically to the second conductive member. The first conductive member is thicker than the second conductive member, and the first wiring substrate is disposed within the opening.

A power semiconductor module includes a laminate substrate; a semiconductor element joined to a front surface of the laminate substrate; a base platejoined to a rear surface of the laminate substrate; a cooling casewhichhas a heat sink, a bottom wall, a side wallformed around the bottom wall, an inlet portionand an outlet portionfor a cooling-liquid which are connected to either the bottom wallor the side wall, in which one end of the side wallis joined to a rear surface of the base platesuch that a cooling liquid can flow into a space surrounded by the base plate, the bottom wall, and the side wall. The power semiconductor module further includes a spacerbetween the inlet portionand the outlet portion

Growing community of inventors

Matsumoto, Japan

Daisuke Inoue