Omron Corporation

Nissin Electric Co., Ltd.

Matsui Shikiso Chemical Co., Ltd.

Kuraray Co., Ltd.

Daisuke Inoue

Yuki Ushiro

Takaaki Sanda

Hiroto Katsura

Yusuke Nakayama

Yosuke Kitagawa

Kiyoshi Ogata

Shuichi Nogawa

Masaki Kariya

Hiroyuki Mizusaki

Kazuyoshi Nishikawa

Akira Kubotsu

Shigeo Matsumaru

Makoto Sugimoto

Yusuke Hayashi

Toru Watanabe

Syuichi Nogawa

Hajime Hashimoto

Naoki Nishimori

Masaki Nakamura

Shuhei Ojiro

Susumu Kutsuhara

Takamasa Kameda

Naomi Uehara

Kazuo Kubota

Eiji Teramoto

Tsutomu Kume

Toyohiro Imaizumi

Hiroshi Shodai

Shinjiro Kotani

Tomonari Imabayashi

Takuya Honjo

Yukitaka Kishimoto

Koichi Hirao

Mikio Hiratsuka

Takashi Yuri

Eiichi Miyake

An electronic apparatus includes: a hard substrate having a first surface with a first wiring layer terminal, a second surface positioned on a back side of the first surface, and an end surface having a second wiring layer terminal and being continuous with the first surface and the second surface; and a flexible substrate having a third surface with a third wiring layer terminal and opposing the first surface of the hard substrate, and a fourth surface having a fourth wiring layer terminal and positioned on a back side of the third surface. The first wiring layer terminal and the fourth wiring layer terminal are electrically connected by solder. The second wiring layer terminal and the third wiring layer terminal are electrically connected by solder.

Electronic apparatus and proximity sensor

Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.

Method of manufacturing sensor

A sensor is provided with a cylindrical-shaped housing which has an opening formed at one end, an electronic component which is housed in the housing, a cylindrical-shaped clamp of which one end is inserted into the housing from the opening, and a sealing resin which seals the gap between the inner wall of the housing and the outer wall of the clamp. On the outer wall, the clamp has a rib which rises towards the inner wall of the housing. The rib includes an apex and a sloped surface which extends from the apex towards another end of the clamp and which intersects the outer wall of the clamp. The sealing resin, which exudes from between the inner wall of the housing and the apex and which is positioned on the sloped surface, has a recess resulting from surface tension.

Sensor and manufacturing method thereof

Provided is a proximity sensor that can limit degradation in voltage resistance. A proximity sensor includes: a housing; a coil portion that is accommodated in one end of the housing; a clamp portion that is connected to the other end of the housing; a substrate which is accommodated inside the housing and the clamp portion, and on which a circuit electrically connected to the coil portion is mounted; a shield that covers a part of the substrate located on a side of the housing; and a resin portion which is arranged inside the housing and the clamp portion, and covers at least a part of the substrate. The shield has an extension portion which extends to an inside of the clamp portion and covers at least a part of the circuit located inside the clamp portion.

Proximity sensor

This proximity sensor includes: a cylindrical housing having an opening at one end in the axial direction; a detection part housed at the other end of the housing and detecting the presence or absence of a detection target contactlessly; a substrate housed in the housing and mounted with a control circuit for controlling the detection part; a detection part shield preventing external noise from entering the detection part and including a first face part adhered to the front surface on the other side of the detection part, and a side face part configured from multiple side pieces connected to the outer periphery of the first face part and bent from the first face part to cover the side surface of the detection part; and a resin provided around the detection part and the detection part shield.

Proximity sensor, and assembly method of proximity sensor

To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and an extension part extending from the base and bonding to the sealing resin part. The bonding intermediating part is fixed to the cable by welding the base onto the sheath.

Electronic apparatus and method of manufacturing same

A required portion of a textile fiber product is subjected to a fiber-modifying treatment by applying a fiber-modifying agent containing at least an aqueous polyvalent cationic salt solution and a urethane resin having a blocked isocyanate group at the end thereof, after which a masking ink containing at least a white or light-colored pigment, a water-soluble polymer dispersing agent, a self-emulsifying urethane resin and/or an acrylic resin having an acid value of 40 to 100 mg KOH/g, and an aqueous liquid as a solvent or disperse medium, is printed by an inkjet process.

Method for image formation and textile fiber products

To provide an electronic apparatus having particularly excellent environmental resistance. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and a cylindrical protrusion protruding toward a tip side of the cable. All of an inner circumferential face and an outer circumferential face of the protrusion and an end face at a tip side of the protrusion in an axial direction are covered by the sealing resin part.

Electronic apparatus and electric cable sealed therein

An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member, a cylindrical clamp holding the cable, and a sealing part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath covering the core wire, and the core wire is exposed at an end of the cable without being covered by the sheath. The bonding intermediating member is bonded to the sheath and the sealing part. The sealing part is formed of an epoxy resin, the bonding intermediating part is formed of a resin having a bending elastic modulus in the range of 80 MPa to 210 MPa, and the cable is formed of a material having a suspending flattening ratio in the range of 0.30 to 0.71.

Electronic apparatus

Method for inkjet textile printing comprising a printing step for printing an aqueous pigment ink on a specifically pretreated portion of a textile fiber product by an inkjet process, wherein said specific pretreatment is performed by applying at least:  [Two of Rto R: alkyl having 8 to 18 carbon atoms; the remaining two: methyl or ethyl; X: anion.]

Method for inkjet textile printing

An inkjet printing ink having properties of crosslinking and being fixed on a fiber by heating, characterized in that in an ink composition consisting of (A) a pigment dispersion having a mean particle diameter of 200 nm or less and a maximum particle diameter of 500 nm or less, consisting of a pigment, a water-soluble pigment dispersant and a hydrophilic solvent, (B) a water-soluble fixing agent, and (C) a crosslinking agent, the water-soluble pigment dispersant in (A) is a specific emulsion polymer neutralized by a basic substance; the water-soluble fixing agent (B) is the one having a crosslinking functional group; and the crosslinking agent (C) is the one having a functional group that crosslinks the crosslinking functional group of the water-soluble pigment dispersant in (A) with the crosslinking functional group of the water-soluble fixing agent (B) at a temperature of 100&#xb0; C. or more.

Inkjet printing ink

A proximity sensor includes a circuit board provided with a processing circuit, a light emitting device mounted on the surface of the circuit board, and a light-transmitting cylindrical light guide surrounding the portion of the circuit board having the light emitting device mounted thereon and guiding the outgoing light from the light emitting device to be emitted to outside. The cylindrical light guide includes the first light emitting surface as the first light outgoing region causing the light emitted from the light emitting device to pass therethrough and directly emitting the light to outside, a reflective surface reflecting the light emitted from the light emitting device to guide the light through the cylindrical light guide in the circumferential direction, and the second light emitting surface as the second light outgoing region emitting, to outside, the light reflected on the reflective surface and propagated through the cylindrical light guide.

A film forming apparatus includes a film forming chamber in which a film is formed on a substrate at a film forming position, a plurality of load lock chambers provided on the film forming chamber through gate valves respectively, a plurality of pivots provided in the film forming chamber correspondingly to the respective load lock chambers, and carrying arms supported by the pivots respectively so as to move the substrate from any one of the load lock chambers to the film forming position and contrariwise from the film forming position to any one of the load lock chambers.

Film forming apparatus

A metal film high in reflectivity and excellent in adhesion to a synthetic resin substrate even in the case where the metal film is sufficiently thin, is formed on a surface of the substrate by sputtering a metal target by ions through an inert gas plasma in a vacuum vessel, wherein the substrate is covered with an electrostatic shield during the sputtering.

Growing community of inventors

Kyoto, Japan

Daisuke Inoue