Renesas Technology Corp.

Nippon Steel Sumitomo Metal Corporation

Daisuke Hirota

Koji Watanabe

Makoto Kanda

Hideki Uchida

Koichi Kondo

Shinji Kamoto

Shunji Matsuzaki

Yusaku Kobayashi

Yugo Matsui

A forging roll device includes, a pair of roll axes which are provided so that an axis center of each of the roll axes are parallel to each other and in which a die is attached to each of the roll axes; and a material holder/conveyer which conveys a held shaping target material between the pair of roll axes, wherein, each one of the pair of roll axes includes a plurality of die attaching surfaces positioned in a circumferential direction, and an outer circumferential surface between any of two of the plurality of die attaching surfaces in each one of the pair of roll axes is closer to a planar surface than a cylindrical surface with the axis center as the center.

Forging roll device

To prevent breakage of a membrane probe during a probe test using a probe card having the membrane probe, appearance of a main surface of a wafer as a test object is tested by an appearance tester, and results of bad appearance such as adhesion of a foreign substance to the main surface of the wafer and abnormality in shape of bump electrodes over the main surface of the wafer are collected as wafer map data according to arrangement of respective chips in a plane of the wafer, then the wafer map data are transmitted to a probe testervia a server, and the probe testeromits the probe test for chips in which bad appearance was detected, and concurrently performs the probe test to other chips in which bad appearance was not detected, based on the wafer map data.

Fabrication method of semiconductor integrated circuit device

Growing community of inventors

Tokyo, Japan

Daisuke Hirota