Denso Corporation

Toyota Jidosha Kabushiki Kaisha

Denso Corpora Tion

Daisuke Harada

Tomohisa Sano

Hiroshi Ishiyama

Hiroki Umeda

Takahisa Kaneko

Kenshi Yamanaka

Hideaki Tachibana

Keisuke Hata

Shinichi Miura

Yoshikazu Suzuki

Hitoshi Imura

Hiromi Yamasaki

Arata Harada

Keita Hatasa

Yohei Imai

Kentaro Hirose

Masatoshi Shinohara

Kazuki Hayashi

Yutaka Morimoto

Takuro Tsutsui

Norihiro Tanaka

Seido Araki

Koichi Nambu

Shoji Tsutsui

In a capacitor device for transferring power between a power source and a target component including an electronic and/or electric component, at least one capacitor is housed in a capacitor case. A busbar is drawn out from the capacitor case. The busbar electrically connects the at least one capacitor to the target component. The capacitor case includes at least first, second, and third fixture members for fixation of the capacitor case. The third fixture member is located to be separated from a virtual line connecting between a first reference point of the first fixture member and a second reference point of the second fixture member, and located to be closer to the target component than the first and second fixture members are. The busbar is located to be closer to the third fixture member than to the virtual line.

Capacitor device

An electric power conversion apparatus includes: a heat-generating element; a case having a cooling wall portion on which the heat-generating element is held and accommodating the heat-generating element; a flow passage cover having an opening formed therein and covering a surface of the cooling wall portion on the opposite side to the heat-generating element; a standing portion standing from the cooling wall portion and inserted in the opening; a flow-passage side wall portion formed in one of the cooling wall portion and the flow passage cover to protrude toward the other; a coolant flow passage surrounded by the cooling wall portion, the flow passage cover and the flow-passage side wall portion; and a sealant that seals both a gap between the cooling wall portion and the flow passage cover at a periphery of the coolant flow passage and a gap between the standing portion and the flow passage cover.

Electric power conversion apparatus

A power conversion device that can prevent decrease in sealing properties between a case and a fixed member. The power conversion device has a case, a fixed member, and a seal member. The case has a metallic case body. The fixed member is fixed to the case from the outside of the case. The seal member adheres closely to both the case and the fixed member to ensure water-tightness between the case and the fixed member. The case is partly formed with a corrosion-resistant portion that is less likely to suffer corrosion than the case body. The fixed member is attached to the corrosion-resistant portion via the seal member.

Power conversion device

An electric device includes a substrate on which electronic components are mounted, and a metal plate to which the substrate is fixed. The metal plate includes first bosses provided at positions corresponding to four corners of the substrate, a second boss provided inside a rectangle that connects the four first bosses, and a slit that is provided adjacent to the second boss, and extends in non-parallel with any side of the rectangle. The substrate is fixed to each of the four first bosses with a first male screw, such that a rubber washer is sandwiched between the substrate and the first male screw. The substrate is fixed to the second boss with a second male screw, such that no rubber washer is sandwiched between the substrate and the second male screw.

Electric device

A power conversion device includes a case including an upper case and a lower case; an inverter that is accommodated in a first partial case and is fixed to the first partial case, the first partial case being one of the upper case and the lower case; and a capacitor that is connected to the inverter by a positive electrode bus bar and a negative electrode bus bar, the capacitor being disposed in an internal space of a second partial case that is another of the upper case and the lower case. The first partial case includes a fastening portion that extends from an internal space of the first partial case to the internal space of the second partial case. In the internal space of the second partial case, the capacitor is fastened to the fastening portion.

A semiconductor device includes a semiconductor module that has an electrode terminal projecting externally; a substrate that has a through hole or a cut-out for inserting the electrode terminal; and a guide member that is provided between the semiconductor module and the substrate and guides the electrode terminal in such a manner that the electrode terminal is inserted into the through hole or the cut-out. The guide member becomes out of contact with the electrode terminal after the electrode terminal is inserted into the through hole or the cut-out.

Semiconductor device

A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Method of manufacturing semiconductor modules and semiconductor module

An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Electric power converter and mounting structure of semiconductor device

Growing community of inventors

Kariya, Japan

Daisuke Harada