Murata Manufacturing Co., Ltd.

Daisuke Hamada

Akihiro Tsuru

Daiki Fukunaga

Masahiro Wakashima

Hideaki Tanaka

Koji Moriyama

Hironori Tsutsumi

Satoshi Maeno

Ryota Aso

Kiyoshiro Ishibe

Toru Wakamatsu

Takehisa Sasabayashi

Kenji Ueno

Junya Tanaka

Ai Fukumori

An electronic component includes first solid solution layer in which a first metal component as a primary component defining a solid solution with a second metal component is located at an interface with a dielectric layer in an end region nearer than a position that is about 5% or more and about 20% or less of a length-direction distance or about 10 μm or more and about 50 μm or less from an end surface of an extended portion of the inner electrode layer to the end surface, and a second solid solution layer in which the first metal component defining a solid solution with the second metal component and with a higher concentration than a concentration in the first solid solution layer is located at an interface with the dielectric layer in a central region of the facing portion in a length direction and a width direction.

Electronic component

In a multilayer ceramic capacitor including first and second inner electrodes alternately arranged with respect to a stacking direction of a multilayer body, a polarity based on a direction of voltage applied between a first outer electrode and a second outer electrode is determined such that the first inner electrodes function as positive electrodes and the second inner electrodes function as negative electrodes. The first inner electrodes have a first metal composition including Cu and Sn, and the second inner electrodes have a second metal composition including Cu. The second metal composition of the second inner electrodes includes Cu as a main component, and at least one metal element selected from Au, Pt, Ir, Pd, Os, Ag, Rh, and Ru, which have standard electrode potentials higher than that of Cu, as an additive component.

Multilayer ceramic capacitor

In a multilayer ceramic capacitor including first and second inner electrodes alternately arranged with respect to a stacking direction of a multilayer body, a polarity based on a direction of voltage applied between a first outer electrode and a second outer electrode is determined such that the first inner electrodes function as positive electrodes and the second inner electrodes function as negative electrodes. The first inner electrodes have a first metal composition including Ni or Cu as a main component, and the second inner electrodes have a second metal composition including at least one metal element selected from Au, Pt, Ir, Pd, Os, Ag, Rh, and Ru, which have standard electrode potentials higher than that of Cu, as a main component.

An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction.

A multilayer ceramic capacitor includes first and second main surfaces opposite to each other in a thickness direction, first and second side surfaces opposite to each other in a width direction, first and second end surfaces opposite to each other in a longitudinal direction, an element body including dielectric layers and internal electrode layers stacked in the thickness direction, and a pair of external electrodes on the first and second end surfaces and electrically connected to the internal electrode layers, in which the dielectric layers include, as a main component, a perovskite oxide including barium and titanium, and the dielectric layers include an inner portion that is in contact with the internal electrode layer and includes an interface layer including a non-perovskite oxide including tin, barium, and titanium.

A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.

Multilayer electronic component and method for manufacturing multilayer electronic component

A multilayer electronic component having an electrode facing portion in which a plurality of internal electrode layers face one another with a dielectric layer interposed therebetween. Each dielectric layer includes Ba, Ti, Si, Re, and M. M is at least one element selected from Mn, Ni, Co, Fe, Cr, Cu, Mg, Li, Al, Mo, W, and V. When the Ti is represented in an amount of 100 parts by mole the dielectric layer at the electrode facing portion has Si in an amount a of 0.01&#x2264;a&#x2264;0.1, Re in an amount b of 0.1&#x2264;b&#x2264;3.0, and M in an amount c of 0.2&#x2264;c&#x2264;5.0. A ratio m of the amount of Ba to the amount of Ti is 0.965&#x2264;m&#x2264;0.990.

Multilayer electronic component

A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces.

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Nagaokakyo, Japan

Daisuke Hamada