Denka Company Limited

Mitsubishi Electric Corporation

Amiteq Co., Ltd.

Dai Nippon Printing Co., Ltd.

Lintec Corporation

Sony Corporation

Mitsubishi Power, Ltd.

Ricoh Company, Ltd.

Mitsubishi Heavy Industries Limited

Daisuke Goto

Hiroyuki Takahashi

Masaomi Sasaki

Hiroshi Sakamoto

Shinji Matsumoto

Kazukiyo Nagai

Hiroaki Tanaka

Tamotsu Aruga

Tohru Yashiro

Takashi Okada

Shigenobu Hirano

Akira Tanabe

Hiroshi Ikuno

Tamotsu Horiuchi

Toshiya Sagisaka

Koh Fujimura

Masafumi Torii

Takeshi Miyakawa

Satoshi Yamamoto

Mamiko Inoue

Yusuke Ono

Yoshihisa Naijo

Takeshi Obara

Kazuya Sakamoto

Yosuke Ishihara

Hideki Hirotsuru

Fuminari Kaneko

Kazuaki Tsuji

Sukchan Kim

Hiroaki Ota

Yasuhiro Yuasa

Kenji Takao

Keiichiroh Yutani

Satoshi Naganawa

Masato Shinoda

Atsutoshi Goto

Naoto Kamekawa

Takayuki Kono

Takanori Tano

Takuji Kato

Keigo Takauji

Takeshi Orito

Suguru Kenmochi

Masahiro Katsumura

Yoshitaka Taniguchi

Masataka Mohri

Yoshitomo Hayashi

Keiichiro Yutani

Naoki Ura

Dai Tsukada

Nobuyuki Akatsu

Shuichi Tanaka

Akimasa Yuasa

Yoshinori Okada

Ryo Kawamura

Hiroyasu Ishigaki

Goh Iwamoto

Kazunori Koyanagi

Sadamu Suidu

Yuuya Kani

Hiroshi Sakamato

Satoshi Yamomato

A production method for an aluminum-diamond composite having a step of providing a laminate structure including a composition layer containing a diamond powder in an opening of a flat plate-like porous material having the opening so as to be separated from an inner circumferential surface of the opening and a step of press-fitting a melt of a metal containing aluminum into a space between the porous material and the laminate structure and impregnating the composition layer with the melt to form a composited part containing aluminum and diamond and forming metal layers on at least side surfaces of the laminate structure, in which the laminate structure includes a first mold release plate, a first inorganic layer, the composition layer, a second inorganic layer and a second mold release plate in this order.

Production method for aluminum-diamond composite

An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 μm or less.

Element-mounted board and method for manufacturing element-mounted board

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by fand a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f, fis less than fby 10 μm or more.

Heat dissipation member and method of manufacturing the same

A molded article having a small difference in thermal conductivities between a central section and a section located at an outer peripheral surface side; and a method for producing the same; wherein, a plate-shaped molded article includes an aluminum-silicon carbide composited section in which a metal including aluminum was impregnated into a silicon carbide porous body, wherein a difference in the densities, by Archimedes' principle, of a central section of the aluminum-silicon carbide composited section and of at least a portion of an outer side section located further toward the outside peripheral surface side than the central section is 3% or less.

Molded article and method for producing same

Among two main surfaces of a heat dissipation member, one main surface is curved to be convex in an outward direction and the other convex in an inward direction. When a straight line passing through both endpoints Pand Pof the curve is l, a point at which a distance to lon the curve is maximum is P, an intersection point between land a perpendicular drawn from Pto lis P, a middle point of a line segment PPis P, an intersection point between the curve and a straight line that passes through Pand is perpendicular to lis P, a length of the line segment PPis L, a length of a line segment PPis H, and a length of a line segment PPis h, (2 h/L)/(H/L) is 1.1 or more.

Filter box for converter

An LED lighting sheet () for animal/plant growth includes an array of LED chips () and has a total luminous flux of 3000 lm or more.

LED lighting sheet for animal/plant growth, LED lighting module for animal/plant growth, shelf for animal/plant growth rack, animal/plant growth rack, animal/plant growth factory, and LED lighting unit for animal/plant growth

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

Ceramic circuit board, heat-dissipating member, and aluminum-diamond composite

A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.

Package accommodating heat dissipation substrate and packing box

A substantially rectangular flat heat dissipation member includes: a composite portion where silicon carbide having voids is impregnated with metal; and a metal portion that is different from the composite portion. Here, a proportion of a volume of the metal portion to a total volume of the heat dissipation member is 2.9% or higher and 12% or lower. In addition, when a length of a diagonal line of the rectangular flat heat dissipation member is represented by L, in a top view where one main surface of the heat dissipation member is a top surface, 40% or higher of a total volume of the metal portion is present in a region D within a distance of L/6 from an apex of any one of four corners of the heat dissipation member. Further, a hole penetrates the metal portion in the region D.

Heat dissipation member

An LED lighting sheet () for animal/plant growth includes an array of LED chips (). At any location 50 mm away from the LED chips () in a lower region below the LED lighting sheet () for animal/plant growth, a photosynthetic photon flux density converted by input power and normalized by an average value over the lower region is greater than or equal to 0.2. A variation in photosynthetic photon flux densities respectively measured at locations 50 mm away from the LED chips () in the lower region below the LED lighting sheet () for animal/plant growth is less than or equal to 0.5 in standard deviation when normalized by the average value.

LED lighting sheet for animal/plant growth, LED lighting module for animal/plant growth, shelf for animal/plant growth rack, animal/plant growth rack, and animal/plant growth factory

To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450&#xb0; C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450&#xb0; C.

Heat dissipation component and method for manufacturing same

Box for converter

Fan unit for converter

A magnetically responsive member is disposed on a rotating member along the circumference of the rotating member in such a manner that the magnetically responsive member rotates together with the rotating member, and the magnetically responsive member is formed in a line-shaped pattern varying cyclically in a rotational axis direction. A stator is disposed around the rotating member in a contactless manner, and the stator includes a primary coil wound around the rotating member, and a secondary coil forming a loop pattern of a plurality of cycles along the circumference of the rotating member. As the primary coil is AC-energized, an induced AC output signal corresponding to relative positions between the line-shaped pattern of the rotating member and the loop pattern of the secondary coil, which depend on a rotational position of the rotating member, is output from the secondary coil.

Induction-type rotation detection device

Growing community of inventors

Tokyo, Japan

Daisuke Goto