Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Nissan Motor Company Limited

Nissan North America, Inc.

Showa Denko Materials Co., Ltd.

Daisuke Fujimoto

Yasuyuki Mizuno

Hikari Murai

Kazuhito Kobayashi

Nozomu Takano

Kazutoshi Danjobara

Hiroshi Shimizu

Naoyuki Urasaki

Akishi Nakaso

Kazuhiko Kurafuchi

Shigeharu Arike

Shinji Tsuchikawa

Kazuhisa Otsuka

Toshimasa Nagoshi

Kunpei Yamada

Atsushi Takahashi

Scott Nydam

Kazunori Yamamoto

Aya Kasahara

Yoshiyuki Tsuru

Yasushi Kumashiro

Nobuyuki Ogawa

Kouichi Tsuyama

Koji Morita

Takayuki Sueyoshi

Naoya Suzuki

Kenichi Tomioka

Kiyoshi Sagara

Jordan Renn

Norihiko Sakamoto

Yutaka Nomura

Takahiro Tanabe

Norio Okano

Toshihisa Nonaka

Toyoki Ito

Hirokuni Ogihara

Hironori Awano

Yusuke Watase

Jeffrey Tessmer

Kazutoshi Danjoubara

A method for producing a semiconductor device of the present invention includes: step (I) of disposing one or more semiconductor elements each having an active surface, on a thermosetting resin film containing a thermosetting resin composition, such that the thermosetting resin film and the active surfaces of the semiconductor elements come into contact; step (II) of encapsulating the semiconductor elements disposed on the thermosetting resin film with a member for semiconductor encapsulation; step (III) of providing openings in the thermosetting resin film or a cured product thereof after step (II), the openings extending to the active surfaces of the semiconductor elements; and step (IV) of filling the openings with a conductor or forming a conductor layer inside the openings.

Method for producing semiconductor device

A roof ditch molding end cap for a roof ditch of a vehicle includes a body member having a first attachment surface and a second attachment surface. The second attachment surface is disposed at an angle with respect to the first attachment surface. The first attachment surface is configured to slidably engage the roof ditch of the vehicle. The second attachment surface has a locking member configured to engage a second fastening member disposed in the roof ditch of the vehicle to substantially prevent movement of the roof ditch molding end cap.

Roof ditch molding end cap

A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

A film-like epoxy resin composition includes an epoxy resin (A); a curing agent (B); a cure accelerator (C);an inorganic filler (D); and an organic solvent (E). The film-like epoxy resin composition satisfies all the following requirements (1) to (4): (1) at least one of the epoxy resin (A) and the curing agent (B) contains a component being a liquid at 25&#xb0; C. in an amount of 30% by mass or more based on the total mass of the epoxy resin (A) and the curing agent (B); (2) the content of a volatile portion that volatilizes by being heated at 180&#xb0; C. for 10 minutes is 0.2% to 1.5% by mass based on the total amount of the epoxy resin composition; (3) the minimum melt viscosity in temperature rising from 40&#xb0; C. to 200&#xb0; C. is 800 Pa&#xb7;s or less; and (4) the film thickness is 50 to 500 &#x3bc;m.

Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device

Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.

Composition of polycyanate ester and biphenyl epoxy resin

A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiOand tetra-functional siloxane unit represented by SiO, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein Rrepresents hydrogen, a halogen, or a C&#x2013;Chydrocarbon group; Rrepresents a halogen or a C&#x2013;Chydrocarbon group; x istoand each of m and n is a natural number; and () a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Thermosetting resin composition and use thereof

An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.

Production of insulating varnishes and multilayer printed circuit boards using these varnishes

A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.

Process for producing multilayer printed circuit board for wire bonding

Growing community of inventors

Chikusei, Japan

Daisuke Fujimoto