Fuji Manufacturing Co., Ltd.

Daisuke Chino

Keiji Mase

Masato Hinata

To cut out a hard-brittle substrate by blasting, laying out substrateson a plate materialmade of a hard-brittle material with leaving a space for blasting; forming first protective filmson both surfaces of the plate materialat layout positions of the substrates; and forming second protective filmson both surfaces of a marginof the plate materialwith leaving a space with respect to the first protective filmsand having outer edges from a periphery of the plate materialat a width of 5 mm or less; cutting regionsbetween the filmsand between the filmsfrom one surface of the plate materialto a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate materialuntil the plate materialis penetrated.

Method and device for cutting out hard-brittle substrate

To cut out a hard-brittle substrate by blasting, laying out substrateson a plate materialmade of a hard-brittle material with leaving a space for blasting; forming first protective filmson both surfaces of the plate materialat layout positions of the substratesand forming second protective filmson both surfaces of a marginof the plate materialwith leaving a space with respect to the first protective filmsand having outer edges from a periphery of the plate materialat a width of 5 mm or less; cutting regionsbetween the filmsand between the filmsfrom one surface of the plate materialto a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate materialuntil the plate materialis penetrated.

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Tokyo, Japan

Daisuke Chino