H.b. Fuller Licensing & Financing Inc.

Daisuke Asai

Jeffrey S Lindquist

Susan T Oeltjen

Yoshihiro Kodama

This invention relates to a removable grade hot melt pressure sensitive adhesive comprising from about 5% to about 30% by weight of the adhesive of a block copolymer having styrene endblocks and ethylene/butylene or ethylene/propylene midblocks and having a coupling efficiency of less than about 65% and a melt index of greater than about 20 grams/10 minutes; from about 10% to about 50% by weight of the adhesive of at least one block copolymer having styrene endblocks and a coupling efficiency from about 65% to about 100%; from about 20% to about 60% by weight of the adhesive of a tackifying resin and from about 10% to about 40% by weight of the adhesive of a liquid plasticizing oil.

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Hamamatsu, Japan

Daisuke Asai