Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Daisuke Ando

Eitaro Miyake

Takahiro Aoki

Toshihiro Tsujimura

Hitoshi Imi

According to one embodiment, a simulation apparatus is disclosed. The simulation apparatus includes a storage device storing data relating to a thermal equivalent circuit of a semiconductor device. The simulation apparatus further includes an estimation device estimating a time-dependent change in thermal characteristics of the semiconductor device by using the data. The thermal equivalent circuit includes a first thermal equivalent circuit corresponding to a lower-surface-side part of the semiconductor device. The thermal equivalent circuit further includes a second thermal equivalent circuit connected to the first thermal equivalent circuit and corresponding to an upper-surface-side part of the semiconductor device.

Simulation apparatus and creation method of thermal equivalent circuit

According to one embodiment, a connection device includes an engaging claw extending in a first direction from a first member, and a receiving portion provided in a second member. The engaging claw includes a pair of first side surfaces, and a pair of engaging protrusions projecting out from the respective side surface. Each engaging protrusion includes an inclined surface continuous from the first side surface and inclined to the first direction. The receiving portion includes a pair of slopes extending in the first direction and each including a second side surface engaging the first side surface, and an engaging projection connected to the second side surface, the engaging projection engaging the engaging protrusion.

Growing community of inventors

Yokohama Kanagawa, Japan

Daisuke Ando