Ngk Insulators, Inc.

Daishi Tanabe

Takao Ohnishi

Shinsuke Yano

Takami Hirai

Makoto Tani

Akifumi Morishita

An electrode embedded ceramic structure includes: a first ceramic layer; an electrode layer formed on the first ceramic layer; and a second ceramic layer covering the first ceramic layer and the electrode layer, the second ceramic layer being thinner than the first ceramic layer. In a cross section of the first ceramic layer, the electrode layer, and the second ceramic layer along a laminating direction in this electrode embedded ceramic structure, T1 and T2 satisfy Equation (T2−T1)/T2≤0.15, where T1 denotes a least thickness in the second ceramic layer, and T2 denotes an average thickness of the second ceramic layer.

Electrode embedded ceramic structure

In the laminated and sintered ceramic circuit board according to the present invention, at least a portion of the inplane conductor is fine-lined, such that the shape of the cross-section surface of the fine-lined inplane conductor is trapezoid, and the height (a), the length (c) of the lower base and the length (d) of the upper base of the trapezoidal cross-section surfaces, and the interval (b) between the lower bases of the trapezoidal cross-section surfaces of the inplane conductors adjacent in a plane parallel to the principal surfaces of the board meet a certain relation. This provides a laminated ceramic circuit board with low open failure rate, short-circuit failure rate and high reliability against high temperature and high humidity in a downsized and short-in-height (thin) semiconductor package.

Growing community of inventors

Niwa-gun, Japan

Daishi Tanabe