Other

Daiqing Wang

Kewen Qiang

Honglei Ji

Zelong Li

A backlight module. The backlight module comprises: an LED chip (), a transparent support (), and a packaging adhesive (); an accommodating groove () is provided on the transparent support (), and the LED chip () is provided at the bottom of the accommodating groove (); the packaging adhesive () is located in the accommodating groove () and covers a light-exiting surface of the LED chip (). The LED chip () and the packaging adhesive () are provided in the accommodating groove (), so that the transparent support () and the packaging adhesive () enlarge a light-exiting angle of the LED chip (), thereby reducing the number of the LED chips () in the backlight module and reducing the production costs.

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Shenzhen, China

Daiqing Wang