The Boc Group, Inc.

Edwards Vacuum LLC

Daimhin Paul Murphy

Colin John Dickinson

Yoshihiro Enomoto

Frank Jansen

Michael S Boger

Christopher M Bailey

C John Dickinson

The present invention relates to the integration of a TMP with the associated bypass line and valves so that a single sub-assembly is created. The housing of the TMP is significantly modified to accommodate the associated equipment necessary for constructing a high-vacuum system.

Integrated high vacuum pumping system

An apparatus and method for processing a microelectronic substrate comprises a main chamber and a movable boundary. The main chamber comprises a main chamber wall enclosing a main chamber interior. The movable boundary is disposed within the main chamber interior, and is movable between a first position and a second position. At the first position, the movable boundary at least partially defines a sub-chamber in which a substrate can be processed. The sub-chamber is fluidly isolated from the main chamber interior, and provides an environment suitable for a high-pressure processing of the substrate such as cleaning or surface preparation. The sub-chamber can be maintained at a high pressure while the main chamber is maintained at either a low pressure, an atmospheric pressure, or at a vacuum. The apparatus can be directly coupled to an external substrate handling and/or fabrication module, such that the main chamber interior provides a buffer between the sub-chamber and the external module. At the second position of the movable boundary, the substrate can be loaded into or removed from the apparatus, such as by transfer to or from any external module provided.

Substrate processing apparatus and related systems and methods

A system is provided that includes a load lock apparatus having an interior configured to receive an object. At least one inlet valve may be flow coupled to the interior of the load lock apparatus, and at least one outlet valve may also be flow coupled to the interior of the load lock apparatus. A controller may be configured to selectively control opening and closing of the at least one inlet valve. The load lock apparatus may include an object receiving mechanism that is movable within the interior of the load lock apparatus to throttle the evacuation of the interior. Several methods of using the system and load lock apparatuses are also disclosed.

Vacuum load lock, system including vacuum load lock, and associated methods

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San Francisco, CA, United States of America

Daimhin Paul Murphy