Fuji Electric Co., Ltd.

Daiki Yoshida

Hiromichi Gohara

Shin Soyano

Takafumi Yamada

Takahiro Koyama

Yuichiro Hinata

Nobuhiro Higashi

Yoshihiro Tateishi

Tsubasa Nakamura

A semiconductor apparatus includes: (i) a semiconductor device; (ii) a first external connection terminal configured to be connected to the semiconductor device, and includes a first surface; and a second surface; and (iii) an insulating resin enclosure. The first external connection terminal includes: a base part that is embedded in the insulating resin enclosure; and a protruding part that protrudes from the inner wall of the insulating resin enclosure. The second surface includes: a first part that corresponds to the protruding part; and a second part that corresponds to the base part and is exposed by the first recessed part. The first part and the second part are continuous with each other along a second direction. The first and second extending parts are spaced apart from each other in a third direction. Each of the first and second extending parts extends along the first direction from a position corresponding to the second surface of the first external connection terminal.

Semiconductor apparatus and manufacturing method for semiconductor apparatus

Semiconductor module

A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device includes a semiconductor chip and a circuit board for mounting the chip. The cooling device includes a top plate mounted in the semiconductor device and having a side wall connected thereto, a bottom plate connected to the side wall, and a refrigerant circulating portion, defined by the top plate, the side wall, and the bottom plate and has a substantially rectangular shape with a cross section parallel to a main surface of the top plate having long and short sides. The circuit board is a substantially rectangular laminated circuit board including an insulating plate having an upper surface with a circuit layer and a lower surface with a metal layer. In a plan view, at least one corner of the metal layer at least partially overlaps with the slope portion of the side wall.

Semiconductor module and vehicle

Growing community of inventors

Matsumoto, Japan

Daiki Yoshida