Mitsui Chemicals, Inc.

Nippon Light Metal Company, Ltd.

Tazmo Co., Ltd.

Mitsu Takeda Chemicals, Inc.

Daiki Taneichi

Kazuo Kohmura

Yosuke Ono

Tsuneaki Biyajima

Hisako Ishikawa

Yasuyuki Sato

Toshiaki Hirota

Atsushi Okubo

Takashi Kozeki

Naoshi Nagai

Yoshihiro Taguchi

Masahiko Mitsuzuka

Shirou Honma

Kazuoki Nakai

Shintaro Maekawa

Akihiro Koide

Shiro Nakatsuka

Manabu Tsuruta

Motoaki Isokawa

Toshimitsu Narutaki

Kiyokazu Koga

Masahiko Mitsuduka

The present invention provides a mask adhesive that plastically deforms easily, no adhesive residue remains after peeling from the mask, ease of handling is excellent, and haze on a pellicle film is unlikely to be increased. A mask adhesive resolving this problem contains a thermoplastic elastomer (A) for which the temperature at which the loss tangent measured at a frequency of 1 Hz is at a maximum value is −20 to 30° C., a tackifier resin (B), and a process oil (C). The total of the proportion (% CP) of paraffin carbon and the proportion (% CN) of naphthene carbon in the process oil (C) is 50% or more. The temperature of the mask adhesive at which the loss tangent measured at a frequency of 1 Hz is at a maximum value is −10 to 30° C., and the sulfur content of the mask adhesive is 300 μg/g or less.

Mask adhesive and pellicle comprising same

To provide a pellicle in which outgas from an adhesive layer is suppressed. The pellicle includes a pellicle film, a support frame for supporting the pellicle film, a protrusion part arranged in the support frame, a first adhesive layer arranged on the protrusion part; and an inorganic material layer arranged at a position closer to the pellicle film than the first adhesive layer. The inorganic material layer may include a first inorganic material layer arranged at a first side surface of the first adhesive layer, the first side surface of the first adhesive layer intersecting the pellicle film, and arranged at a position closer to the pellicle film.

Pellicle, exposure master, exposure device and method for manufacturing semiconductor device

A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle () includes a pellicle film (); a support frame (); and a first adhesive layer () provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer () on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (&#x3bc;) in the range of 5&#xd7;10cm/g to 2&#xd7;10cm2/g.

Pellicle, exposure original plate, exposure device, and semiconductor device manufacturing method

The present invention provides; a pellicle frame which can effectively inhibit distortion of the photo mask () caused by mounting the pellicle (), and which does not have a complex shape, and a pellicle which uses said pellicle frame are provided, and a manufacturing method of a blackened pellicle frame is also provided which can reduce the defect of the surface flickering under concentrated light and which facilitates inspection of the foreign matter adhesion prior to use. The present invention relates to a pellicle frame with an anodized film on a surface of an aluminum alloy frame, characterized in that: the aluminum alloy frame comprises an aluminum alloy which contains Ca: 5.0 to 10.0% by mass with the remainder aluminum and unavoidable impurities are contained, and has an area (volume) ratio of an AlCa phase, which is a dispersed phase, is greater than or equal to 25%, and a crystal structure of a part of the AlCa phase is monoclinic; wherein the AlCa phase dispersed in the anodized film is anodized, and the anodized film is stained with a black dye.

Pellicle frame and pellicle

A method for producing a pellicle according to the one embodiment of the present invention produces a pellicle including a pellicle film and a pellicle frame supporting an outer peripheral portion of the pellicle film. The method includes forming the pellicle film on a substrate, and bonding a pressure-sensitive adhesive sheet, that is elastic and has a pressure-sensitive adhesive force thereof decreased upon receipt of external stimulation, to each of two surfaces of the substrate; making a notch inside a part of the substrate, the part having the pressure-sensitive adhesive sheets bonded thereto; separating a substrate outer peripheral portion outer to the notch of the substrate, in a state where the pressure-sensitive adhesive sheets are bonded to the substrate, to form a pellicle frame; and stimulating the pressure-sensitive adhesive sheets to peel off the pressure-sensitive adhesive sheets.

Pellicle manufacturing method and method for manufacturing photomask with pellicle

The purpose of the present invention is to provide: a pellicle frame which is not susceptible to deterioration even if irradiated with short-wavelength light such as excimer light, and which is not susceptible to generation of an outgas or foreign substance; and a pellicle which uses this pellicle frame. In order to achieve the above-described purpose, this pellicle frame for supporting the outer periphery of a pellicle film is configured to comprise a frame and a film that is formed on the surface of the frame and contains a polyimide resin.

Pellicle frame, pellicle containing same, method for producing pellicle frame, and method for producing pellicle

Provided are a pellicle for extreme ultraviolet light lithography, a method for producing the same, and an exposure method. A pellicle according to the present invention includes a first frame having a pellicle film located thereon; a second frame supporting the first frame; a through-hole running through the first frame; and a filter covering the through-hole on the side of a surface of the first frame on which the pellicle film is located. The through-hole may run through the pellicle film; and the filter may be located on the pellicle film. The filter may be located, adjacent to the pellicle film, on the first frame.

Pellicle, pellicle production method and exposure method using pellicle

Provided are a pellicle for extreme ultraviolet light lithography, a production method thereof, and an exposure method. A pellicle according to the present invention includes a first frame having a pellicle film located thereon; a second frame including a thick portion including a first surface carrying a surface of the first frame opposite to a surface on which the pellicle film is located, and also including a second surface connected with the first surface and carrying a side surface of the first frame, the second frame enclosing the pellicle film and the first frame; a through-hole provided in the thick portion of the second frame; and a filter located on an outer side surface of the second frame and covering the through-hole, the outer side surface crossing the surface of the first frame on which the pellicle film is located.

Pellicle, production method thereof, exposure method

A pellicle frame containing a frame body, the frame body having a groove formed in one end surface of the frame body, the one end surface being an end surface in a thickness direction of the frame body that is located at a side configured to support a pellicle membrane, and a through-hole that penetrates through a portion between an outer circumferential surface of the frame body and a wall surface of the groove formed in the one end surface.

Pellicle frame, pellicle and method of manufacturing the same, original plate for exposure and method of manufacturing the same, exposure device, and method of manufacturing semiconductor device

Provided is a support frame for pellicles which includes an aluminum alloy-made frame body with a pellicle film bonded to a front surface of the frame body, and with a glass substrate bonded to a back surface of the frame body. A front-side recessed groove extending in a circumferential direction of the frame body is formed on the front surface of the frame body, and a front-side suction hole extending from an outer peripheral surface of the frame body to an inner surface of the front-side recessed groove is formed on the frame body.

Support frame for pellicles

A pellicle which has a mask adhesive layer that can be plastic-deformed readily particularly at a temperature at which exposure to light is carried out, rarely provides a residue of an adhesive agent upon the removal of the mask adhesive layer from a mask and has good handling properties, and which can prevent the position gap of a pattern. The pellicle comprises a pellicle frame, a pellicle membrane and a mask adhesive layer containing a mask adhesive agent. The mask adhesive agent comprises 100 parts by mass of a thermoplastic elastomer (A) having a tan &#x3b4; peak temperature of &#x2212;20 to 30 DEG C and 20 to 150 parts by mass of an adhesiveness-imparting resin (B).

Pellicle and mask adhesive agent for use in same

Polymers having polyolefin segments as the side chain, with a structural unit represented by the following Formula (1): wherein A is an olefin polymer having a weight average molecular weight of 400 to 500,000; R is H, an alkyl group, or an aralkyl group; W and Z are each O, HN, or S; and x and y are each 0 or 1, with the proviso that at least one of them is 1. The polymer can be applied as an antistatic agent, a cosmetic additive, a releasing agent for toner, a pigment dispersant, a lubricant for vinyl chloride resins, a coating material, an emulsion composition and the like.

Polymers and uses thereof

The paste composition of the present invention is a paste composition comprising (i) a polyurethane resin which comprises (a) a recurring unit represented by the formula (1) and (b) a recurring unit represented by the formula (2), a molar fraction of said recurring unit (a) being in the range of 0.35 to 0.99, a molar fraction of said recurring unit (b) being in the range of 0.01 to 0.65, the total of both the molar fractions being 1, (ii) a solvent and (iii) a powder. By the use of the paste composition, dielectric layers, sealing products, barrier ribs, phosphors, etc. can be favorably formed.

Growing community of inventors

Chiba, Japan

Daiki Taneichi