Ricoh Company, Ltd.

Daiki Minegishi

Hiroshi Miura

Eiji Mochizuki

Yasuhiro Satoh

Masayuki Fujishima

Hisaaki Koseko

An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.

Imaging module, fabricating method therefor, and imaging device

A method of fabricating a plastic molded article is disclosed. In the method, a compound liquid, including two component liquids insoluble in each other and having different dielectric constants, is supplied between two electrodes, and an electric field is applied between the electrodes. At least one of the component liquids is an un-cured curable resin liquid. Upon application of the electric field, the higher dielectric constant component liquid is extended along the direction of the electric field, thus forming a bridge structure linking the electrodes. When the curable resin is cured after the bridge structure is formed, a plastic molded article is obtained.

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Kanagawa, Japan

Daiki Minegishi