Sumitomo Riko Company Limited

Fujimi Incorporated

Daiki Ito

Yasuyuki Hayasaki

Satoshi Endo

Daisuke Inoue

Toshio Shinoda

Tsukasa Fujita

Yasuhide Watanabe

Fumio Misumi

Teruyoshi Kimpara

Hironari Nishioka

Sho Sakamoto

Shingo Nakaichi

Isamu Maruyama

A conveying belt has a cylindrical base layer, and a surface layer that is formed on the outer peripheral surface of the base layer. The base layer contains polyimide or polyamide-imide, and has an elastic modulus from 3-7 GPa, inclusive. The surface layer is configured as a cured object from a resin composition that contains a fluororesin having a hydroxy group, an isocyanate curing agent, and a silicone copolymer. The silicone copolymer is a copolymer containing a silicone unit and another kind of unit not having a siloxane skeleton, has a hydroxy group, and contains siloxane units in a proportion of at least 95 mol % and less than 100 mol %, or from 40-70 mol %, inclusive. The silicone copolymer content in the resin composition is 1-5 parts by mass, inclusive, relative to a total 100 parts by mass of the fluororesin and the isocyanate curing agent.

Conveying belt

There is provided a polishing composition capable of improving the polishing removal rate of silicon nitride to polish silicon oxide and silicon nitride at the same polishing removal rate and polishing silicon nitride with a small number of defects. A polishing composition contains: abrasives having a positive zeta potential; and a cyclic compound having a mother nucleus with a ring structure and two or more anionic functional groups bonded to the mother nucleus, in which the abrasives contain silica. This polishing composition is used for polishing objects to be polished containing silicon oxide and silicon nitride.

Polishing composition and polishing method

A polishing composition according to the present invention contains silica, a nitrogen-containing alkaline compound, and hydrogen peroxide, in which a content of the hydrogen peroxide is more than 0% by mass and less than 0.03% by mass with respect to the total mass of the polishing composition, and a pH exceeds 9.

Polishing composition, polishing method, and method of producing semiconductor substrate

Provided is an endless belt which can improve rotational durability when compared to a conventional endless belt. This endless belt is formed in a tubular shape and is used for electronic photographing apparatuses. The endless belt has an edge part which is formed on at least one belt edge in the belt width direction and which has an end that is tapered toward the outside of the belt width direction. The edge part can be configured by a first edge part formed by intersecting an outer inclined surface with a belt inner circumferential surface, a second edge part configured by intersecting an inner inclined surface with a belt outer circumferential surface, or a third edge part configured by intersecting the outer inclined surface with the inner inclined surface.

Endless belt

Growing community of inventors

Aichi, Japan

Daiki Ito