Toyobo Co., Ltd.

Toyobo Mc Corporation

Daiki Funaoka

Yoshitaka Tanaka

Shigeyuki Watanabe

Nobuhiro Yoshimura

Takafumi Masuda

Ryo Umeki

Kenji Shiga

Ryo Hamasaki

Junki Saito

The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive layer containing a thermal adhesive polyolefin resin and provided on each of both surfaces of the substrate layer so as to be in direct contact therewith by coextrusion. When a machine direction is defined as an X axis, a transverse direction is defined as a Y axis, and a thickness direction is defined as a Z axis, the film is stretched and oriented in at least one direction of the X axis or the Y axis, and has a thermal deformation rate at 150° C. of 4% or less in both directions of the X axis and the Y axis.

Thermal adhesive laminated oriented film

It is provided that a layered body having excellent absorption speeds of fuel and the like to the filter media. A layered body comprising a first base material and a second base material, wherein the first base material and the second base material are adhered to each other via an adhesive, the first and second base materials each contain a phenol-based resin and an aliphatic hydrocarbon detected during a retention time of 12.0 to 30.0 minutes under pyrolysis-gas chromatography mass spectrometry (PY-GC/MS), and the adhesive contains 65 mol % or more of a butylene terephthalate unit and 5 mol % or more of a butylene isophthalate unit, and has an acid value of not larger than 100 eq/ton, a glass transition temperature of −10 to 60° C., and a specific gravity of not less than 1.20.

Layered body

An object of the present invention is to provide a technique by which, when producing a resin molded article using an insert member having low pressure resistance, molding can be easily performed, and deformation of the insert member can be suppressed. A method for producing a resin molded article of the present invention, the method includes the steps of disposing an insert member in a cavity of a mold; performing injection of molten resin into the cavity; terminating the injection on and after the molten resin reaches an overflow portion in the cavity and before the molten resin fills the overflow portion; and separating resin in the overflow portion.

Resin molded article and method for producing resin molded article

It is provided that a resin composition for sealing electrical electronic components which is not susceptible to gelation even when stagnant under high temperature conditions, and which are excellent in initial bond strength to an aluminum material, and which exhibits superior durability under a cooling and heating cycle load and the like. It is also provided that a sealed electrical electronic component with the resin composition for sealing electrical electronic components. A resin composition for sealing electrical electronic components, containing a crystalline polyester-based elastomer (A), a phenol-modified xylene resin (B1) and/or a phenol resin (B2), and a polyolefin resin (C), and having a melt viscosity of 5 dPa&#xb7;s or more and 3000 dPa&#xb7;s or less when dried to a water content of 0.1% or less, heated to 220&#xb0; C., subjected to a pressure of 1 MPa, and extruded through a die with a hole diameter of 1.0 mm and a thickness of 10 mm.

Resin composition for sealing electrical electronic components, method of producing electrical electronic component, and sealed electrical electronic component

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Tokyo, Japan

Daiki Funaoka