Screen Holdings Co., Ltd.

Daiki Fujii

Shigeru Yamamoto

Kenji Edamitsu

Keiji Iwata

Yuya Kawai

Kenichi Ito

Tetsuya Emoto

Takashi Akiyama

A substrate treating apparatus includes a process tank for storing a treatment liquid, a chamber for surrounding the process tank, a solvent vapor nozzle for supplying solvent vapor into the chamber, a cleaning liquid nozzle for supplying a cleaning liquid, and a controller. The controller causes immersion treatment, where a substrate is immersed in the treatment liquid stored in the process tank, to be performed for a preset period of time, and causes dry treatment, where the substrate processed with the treatment liquid and taken out of the process tank is dried with the solvent vapor supplied from the solvent vapor nozzle, to be performed. The controller causes the cleaning liquid nozzle to supply the cleaning liquid into the chamber and causes the process tank to be immersed in the cleaning liquid stored in the chamber, whereby the chamber cleaning treatment, where the chamber including an outer wall of the process tank is cleaned, is performed.

Substrate treating apparatus and substrate treating method

A substrate processing method is provided. The substrate processing method includes: (S) supplying a water repellent agent (SMT) to a substrate (W); (S) supplying dilute isopropyl alcohol (dIPA) to the substrate (W) after the supplying a water repellent agent (SMT), the dilute isopropyl alcohol (dIPA) being obtained by diluting isopropyl alcohol; and (S) drying the substrate (W) after the supplying dilute isopropyl alcohol (dIPA).

Substrate processing method

A substrate treatment method includes a rinsing step of performing treatment of a substrate with a rinse liquid, an immersing step of immersing the substrate in a diluted isopropyl alcohol (dIPA) stored in a treatment tank after the rinsing step, a first isopropyl alcohol treatment step of performing treatment of the substrate with an isopropyl alcohol after the immersing step, and a water-repellent treatment step of performing water-repellent treatment of the substrate after the first isopropyl alcohol treatment step.

Substrate treatment apparatus and substrate treatment method

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Kyoto, Japan

Daiki Fujii