Daicel Corporation

The University of Tokyo

Daicel Polymer Ltd.

Daiji Ikeda

Junichi Takeya

Toshihiro Okamoto

Yasuyuki Akai

Tadanori Kurosawa

Takeshi Yokoo

Yoshihiro Asami

Yu Yamashita

Dinghai Cen

Provided is a compound that is excellent in chemical stability, has high solubility in a solvent, and exhibits excellent carrier mobility. A compound represented by Formula (1):

Compound and application thereof

Provided is a conductor material having high conductivity. The conductor material according to an embodiment of the present disclosure has a configuration in which a conjugated polymeric compound having an electron donating group containing a heteroatom in a side chain is doped with a dopant containing an anion selected from a nitrogen anion, a boron anion, a phosphorus anion and an antimony anion, and a counter cation. The anion is preferably an anion represented by Formula (1) below: where Rand Rare identical or different, and each represent an electron withdrawing group; and Rand Rmay be bonded to each other to form a ring with an adjacent nitrogen atom.

Conductor material

Provided is a dopant with which a conductor material having high electrical conductivity can be formed. The present disclosure relates to a dopant containing a radical cation represented by Formula (1) and a counter anion. In Formula (1), Rto Rmay be the same or different, and each denotes a monovalent aromatic group or a group represented by Formula (r). at least one of Rto Ris a group represented by Formula (r), and n indicates the valence of the radical cation and is equal to the quantity (n) of nitrogen atoms in the formula. In Formula (r), Ar, Ar, and Armay be the same or different, and each denotes a divalent aromatic group, and Ar, Ar, Ar, and Armay be the same or different, and each denotes a monovalent aromatic group optionally having a substituent represented by Formula (sb) below. Furthermore, m and n may be the same or different, and each represents an integer of 0 or greater.

Dopant and conductor material

A novel dopant according to the present disclosure includes an anion represented by the following Formula (1) and a counter cation. In Formula (1), Rand Rmay be each at least one group selected from a nitro group, a cyano group, an acyl group, a carboxyl group, an alkoxycarbonyl group, a haloalkyl group, a sulfo group, an alkylsulfonyl group, an halosulfonyl group, and a haloalkylsulfonyl group, or may be a group formed by Rand Rbonded to each other [—SO-L-SO—] (where L represents a haloalkylene group). The counter cation may be a radical cation represented by Formula (2), where Rand Rrepresent electron-withdrawing groups that may be bonded to each other to form a heterocycle, and Rto Rrepresent a hydrogen atom, a hydrocarbon group that may have a substituent, or a heterocyclic group that may have a substituent. The dopant is capable of forming an electroconductive composition that shows a high conductivity.

Dopant, electroconductive composition and method for producing same

There is provided a method of manufacturing a composite molded body that can increase a processing speed and a joining strength in a different direction. The method of manufacturing a composite molded body in which a metal molded body and a resin molded body are joined, includes the steps of: continuously irradiating a joint surface of the metal molded body with laser light at an irradiation speed of 2,000 mm/sec or more by using a continuous-wave laser; and arranging, within a mold, a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and performing injection molding of a resin forming the resin molded body, or performing compression molding in a state where a portion of the metal molded body including the joint surface irradiated with the laser light in the preceding step and a resin forming the resin molded body are made to contact with each other.

Method of manufacturing composite molded body

A composite molded article contains a metal molded article and a resin molded article, which are bonded to each other, in which the metal molded article has a roughened bonding surface, a surface layer portion of the metal molded article including the roughened bonding surface has: open holes containing: a stem hole that is formed in a thickness direction and has an opening on the side of the bonding surface, and a branch hole that is formed from an inner wall of the stem hole in a different direction from the stem hole, and the composite molded article is bonded in such a state that the resin permeates into the open holes formed on the bonding surface of the metal molded article.

Growing community of inventors

Himeji, Japan

Daiji Ikeda