Kabushiki Kaisha Toshiba

Toshiba Lighting & Technology Corporation

Kioxia Corporation

Daigo Suzuki

Akihiko Happoya

Hidenori Tanaka

Makoto Sakai

Izuru Komatsu

Kazuki Tateyama

Michinobu Inoue

Hiroshi Ota

Nobuhiro Yamamoto

Takeshi Hisayasu

Minoru Takizawa

Hideo Nishiuchi

Takumi Suwa

Toshitake Kitagawa

Shinji Nakata

Yasuhide Okada

Jun Karasawa

Gen Fukaya

Kumiko Ioka

Yasuhiro Fukuju

Kosuke Awaga

A semiconductor storage device includes a housing, an interface substrate attached to the housing, an insulating substrate in the housing, a first flexible substrate connecting the insulating substrate and the interface substrate, a first integrated circuit on a first surface of the insulating substrate, and a first heat conductor arranged on a second surface of the insulating substrate that is opposite to the first surface, and contacting a first inner surface of the housing.

Semiconductor storage device

A printed wiring board includes a first insulator, a second insulator, a first conductor, and a second conductor. The first conductor is between the first insulator and the second insulator. The first conductor contains a first conductive material. The second conductor includes a first portion. The first portion is between the first insulator and the first conductor. The first portion is in contact with the first conductor and extends along the first conductor. The second conductor contains a second conductive material. The second conductive material is lower in electrical resistivity than the first conductive material. The second insulator is closer to an outside of the printed wiring board than the first insulator is in a thickness direction of the printed wiring board.

Printed wiring board, memory system, and method for manufacturing printed wiring board

A fastener having threads includes a main body including a head portion and a thread portion having the threads, a sensor mounted on the main body and configured to detect orientation of the fastener, and a wireless module mounted on the main body and configured to transmit data indicating the detected orientation through a wireless signal.

Fastener including a wireless module and a wireless device attachable to the same

According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.

Electronic component and electronic unit

According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

Printed wiring board

A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.

Self-ballasted lamp and lighting fixture

According to one embodiment, the illuminating device of the embodiment has a base part and multiple light emitting elements; the illuminating device includes a supporting part, which is arranged on one end of the base part, and which at least partially encloses an internal space. The supporting part also has an outer surface exposed to the ambient atmosphere. The multiple light emitting elements are disposed on the inner surface side of the supporting part so that at least light emitting surfaces of the light emitting elements are in contact with the supporting part.

Illuminating device

According to one embodiment, an LED lamp includes an LED module and a light guide. The LED module includes a plurality of LEDs annularly arranged and mounted on a front surface of a board, and an opening provided in the board at an inside surrounded by the LEDs. The light guide is engaged and fastened to the opening from the front surface side of the board. The light guide guides part of light emitted by the LEDs, and emits the light guided from the front surface side to a rear surface side over an outer edge part of the board.

Bulb-type LED lamp having a widened luminous distribution via a fastened waveguide

A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

Luminaire

According to one embodiment, the flexible printed wiring board of the one embodiment has a base, corrugated portion, and block. The base has therein a conductor that electrically connects a first end and a second end. The corrugated portion is formed in a middle part of the base and has a ridge and legs. The ridge is roundly bent. The legs continuously hang from opposite sides of the ridge. The block is located off the ridge within a gap where the legs face each other and is mounted on one of the legs.

Flexible printed wiring board and electronic apparatus

According to one embodiment, an electronic device includes a circuit board housed in a housing. The circuit board further includes a conductive layer, an insulating layer and a signal line. The conductive layer includes a base portion including a surface, a plurality of first projecting portions formed integrally with the base portion and extending in parallel with each other on the surface of the base portion, and a plurality of second projecting portions formed integrally with the base portion and extending in parallel with each other to cross the plurality of first projecting portions. The insulating layer is stacked on the conductive layer to cover the surface of the base portion, and the signal line is stacked on the insulating layer and extends in a direction crossing directions in which the first and second projecting portions extend.

Electronic device and circuit board

According to one embodiment, there is provided a printed-wiring board, includes a first base member including a component mounting face, a first electronic component with a through-electrode mounted on the component mounting face, a second base member stacked on the first base member via an insulating layer covering the first electronic component, a hole part provided in the second base member and communicating with the through-electrode of the first electronic component, and a second electronic component mounted on the second base member and circuit-connected directly to the through-electrode via the hole part.

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.

Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

According to one embodiment, a printed circuit board includes a first dielectric layer, a circuit component mounted on the first dielectric layer, and a second dielectric layer. The first dielectric layer is provided with a via hole which opens at a surface thereof and in which a conductive layer is provided, and a conductive pattern connected electrically to the conductive layer of the via hole. The circuit component is provided with a bump at least a part of which is inserted in the via hole and bonded to an inner surface of the via hole. The second dielectric layer is formed provided with another conductive pattern and laminated to the first dielectric layer to cover the circuit component.

Printed circuit board, electronic device, and manufacturing method for printed circuit board

An insulating substrate includes a first area where a semiconductor device is disposed, a second area where a wiring electrically connecting to the semiconductor device is disposed, and a third area where a terminal electrically connecting to the wiring is disposed. A first wiring is disposed on a main surface of the insulating substrate in the second area and connects to the second wiring disposed in the first area and the terminal disposed in the third area through first and second interlayer connecting portions. With this configuration, the second wiring need not be disposed in the second area, so that flexibility in the second area used as a connecting portion increases.

Growing community of inventors

Yokohama, Japan

Daigo Suzuki