Momentive Performance Materials Japan LLC

Daigo Hirakawa

Masanori Takanashi

Isao Iida

Kenji Takenaka

Eiji Tanigawa

Atsushi Sakamoto

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Thermally conductive polyorganosiloxane composition

A siloxane compound represented by the general formula (1): where Ris a group having an alkoxysilyl group having 1 to 4 carbon atoms, Ris a linear organosiloxy group represented by the general formula (2): where each Ris independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each Ris independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Surface treatment agent for thermally conductive polyorganosiloxane composition

A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Method for producing a thermally conductive polysiloxane composition

The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 &#x3bc;m to 150 &#x3bc;m in an amount of at least 20% by mass, based on the mass of a total of the component (A).

Thermally conductive polysiloxane composition

A thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler, (B) an alkoxysilane compound or dimethylpolysiloxane, and (C) a polyorganosiloxane (not inclusive of the dimethylpolysiloxane of component (B)), wherein component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a filler having an average particle size of 50 &#x3bc;m or more in an amount of 30% by mass or more; component (B) and component (C) are included in a total amount of 1.5 to 35 parts by mass relative to 100 parts by mass of component (A); and a content ratio of component (C) in the total amount of component (B) and component (C) is 15 to 98% by mass.

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Tokyo, Japan

Daigo Hirakawa