Oki Semiconductor Co., Ltd.

Daigo Chabata

Yoshihiro Saeki

Shinji Hiratsuka

A semiconductor device according to the present invention comprises, on a first semiconductor chip, a first circuit element region in which a first electrode group is arranged along an outer periphery of the first semiconductor chip in such a manner as to surround a second semiconductor chip, a second electrode group is arranged along the outer periphery of the first semiconductor chip in such a manner as to surround the first electrode group, and the first semiconductor chip is surrounded by the first electrode group, and a second circuit element region which surrounds the first electrode group and is surrounded by the second electrode group.

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Tokyo, Japan

Daigo Chabata