Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Daido Komyoji

Takao Inoue

Naomi Nishiki

Junji Ikeda

Hidenobu Nishikawa

Kenichi Yamamoto

Hiroyuki Yamada

Shigeaki Sakatani

Yoshihiko Yagi

Takashi Ichiyanagi

Masato Mori

Koichi Nagai

Daisuke Suetsugu

Kazuma Oikawa

Makoto Morita

Shuichi Takeda

Tsutomu Kawashima

Kazuhiro Nishikawa

Yutaka Nakamura

Norihito Tsukahara

Kazuhiro Mori

Kazushi Higashi

Yoshihiro Tomura

Hiroyuki Naka

Kazuki Fukada

Naoto Hosotani

Akira Kumon

Katsuhiko Yamamoto

Katsutoshi Ogawa

Akira Fukano

Shinji Ishitani

Masayoshi Koyama

Takashi Imanaka

Takashi Tsuruta

Tooru Wada

Naoko Matsuda

Shigeru Kondou

Hirotaka Hisamura

Shigeki Sakaguchi

Atsunobu Iwamoto

Keiichi Iwata

Noboru Izutani

Yasuyuki Watanabe

Kouichi Yoshida

Keizaburo Kuramasu

Yasuharu Kikuchi

A manufacturing method of a heat insulating sheet of the present disclosure includes a composite generating step of impregnating a nonwoven fiber with a basic sol prepared to generate a composite of a hydrogel-nonwoven fiber, the basic sol being prepared by adding carbonate ester to a water glass composition; and a drying step of drying a liquid contained in the composite at a temperature lower than a critical temperature of the liquid and a pressure lower than a critical pressure of the liquid to remove the liquid from the composite. A heat insulating sheet according to the present disclosure includes an aerogel and a nonwoven fiber, and has a compression rate at 0.30 MPa to 5.0 MPa of 40% or less. In an electronic device of the present disclosure, the heat insulating sheet is disposed between an electronic component and a housing. In a battery unit of the present disclosure, the heat insulating sheet is disposed between batteries. This provides a heat insulating sheet that can be used under a high load and a manufacturing method thereof, and an electronic device and a battery unit including the same.

Heat insulating sheet and method of manufacturing thereof, and electronic device and battery unit using heat insulating sheet

A heat insulating material includes an aerogel that has macro-pores and meso-pores. A method for manufacturing a heat insulating material, including: a sol preparation step of adding a gelling agent into sodium silicate such that a molar ratio of the gelling agent relative to NaOis 0.1 to 0.75, and adjusting a sol into which macro-pores are introduced by leaving unreacted Na and non-cross-linked oxygen in a siloxane skeleton; an impregnating and gelling step of impregnating a nonwoven fabric fiber structure with the sol to form a composite of hydrogel-nonwoven fabric fiber; a hydrophobizating step of mixing the formed composite of hydrogel-nonwoven fabric fiber with a silylating agent to modify a surface thereof; and a drying step of removing a liquid contained in the surface modified composite of hydrogel-nonwoven fabric fiber by drying under a temperature and pressure lower than respective critical values.

Heat insulating material, method for manufacturing same, and electronic equipment and automobile using same

A pin () is moved down in a nozzle (), the end of paste () protruded from the discharge opening () of the nozzle () to a target object () is brought into contact with the target object (), and the pin () is moved away from the discharge opening () to divide the paste in contact with the target object.

Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

Circuit board and process for producing the same

Memory card () includes at least semiconductor chip (), circuit board () with semiconductor chip () mounted on main surface (), having at least rigidity reducing portion () formed in main surface () or in a linear region of surface () opposite to the main surface, and cover portion () for covering semiconductor chip () on main surface () of circuit board (), wherein circuit board () has a plurality of convex regions () which flex in a convex shape toward main surface () due to rigidity reducing portion ().

Memory card

Three-dimensional structure () of the present invention includes first module board (), second module board (), and substrate joining member () that unifies board () and board () into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing () of substrate joining member () with resin (). Substrate joining member () used in the three-dimensional structure () includes multiple lead terminals () made of conductive material, and a frame-shaped and insulating housing () to which frame the lead terminals () are fixed vertically in a predetermined array. Housing () includes projections () on at least two outer wall faces of its frame shape.

Substrate joining member and three-dimensional structure using the same

Relay substrate () connecting between at least a first circuit board and a second circuit board, including housing () having recess () provided in the outer circumference and hole () provided in the inner circumference; plural connecting terminal electrodes () connecting between the top and bottom surfaces of housing (); shield electrode () provided in recess (); and ground electrode () provided on a part of the top and bottom surfaces of housing ().

Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate

Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

A recess portion is formed on a board surface at a position facing a peripheral end portion of a semiconductor device so as to place a sealing-bonding resin partially inside the recess portion. Thereby, increases of a placement area for a fillet portion (foot spreading portion) of the sealing-bonding resin are suppressed while its inclination angle is increased. Thus, stress loads that occur to peripheral portions of the semiconductor device due to thermal expansion differences and thermal contraction differences among individual members caused by heating and cooling processes during a mounting operation are relaxed, by which internal breakdown of the semiconductor device mounted structure is avoided.

Semiconductor device mounted structure and semiconductor device mounted method

A configuration includes a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

Sheet-like composite electronic component and method for manufacturing same

A capacitor-equipped semiconductor device includes a semiconductor chip having a plurality of electrode terminals; a sheet-like substrate at least having a film capacitor; and a mounting substrate. The mounting substrate is provided on one side thereof with chip connection terminals and ground terminals. The chip connection terminals are disposed to correspond to the electrode terminals of the semiconductor chip. The ground terminals are disposed to correspond to the one electrode terminals of the film capacitor of the sheet-like substrate. The mounting substrate is provided on the other side thereof with external connection terminals connected to the chip connection terminals and the ground terminals and used to mount the mounting substrate on an external substrate.

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.

Electronic circuit connection structure and its manufacturing method

In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 &#x3bc;m.

Semiconductor device

When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Component connecting apparatus

Growing community of inventors

Nara, Japan

Daido Komyoji