Hitachi Chemical Company, Ltd.

Daichi Takemori

Hiroyuki Kawakami

Takuya Imai

Katsuyasu Niijima

Naoki Tomori

A sealing film which includes a resin layer having a flow within the range of 150 to 1800 &#x3bc;m at 80&#xb0; C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa&#xb7;s in a B-stage state at 50 to 100&#xb0; C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of &#x2212;50 to 50&#xb0; C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 &#x3bc;m, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.

Sealing film and a semiconductor device using the same

A method for sealing electrodes on a semiconductor device using a sealing film which includes a resin layer having a flow within the range of 150 to 1800 &#x3bc;m at 80&#xb0; C., or having a resin layer with a viscosity within the range of 10,000 to 100,000 Pa&#xb7;s in a B-stage state at 50 to 100&#xb0; C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of &#x2212;50 to 50&#xb0; C. and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 &#x3bc;m, and (C) a colorant.

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Chiba, Japan

Daichi Takemori