Toray Industries, Inc.

Daichi Miyazaki

Masao Tomikawa

Tomoki Ashibe

Masahito Nishiyama

Akinori Saeki

Koji Ueoka

A resin composition for display substrates includes the following: the resin (a): a resin containing, as a main component, a repeating unit represented by the chemical formula (1), wherein the resin contains the total of 95 mass % or more of a tetracarboxylic acid residue A, having 2 or more carbon atoms and an SP value of 15 or more and 17 or less and a diamine residue having an SP value of 11 or more and 13 or less with respect to the total of 100 mass % of A and B contained in the resin; the solvent (b): a solvent having an SP value of 7.5 or more and less than 9.5; and the solvent (c): a solvent having an SP value of 9.5 or more and 14.0 or less;

Resin composition for display substrate, resin film for display substrate and laminate body containing this, image display device, organic EL display, and manufacturing method of these

A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25&#xb0; C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

Resin composition for display substrate, and heat-resistant resin film, organic EL display substrate, and method for manufacturing organic EL display using same

An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), &#x3b4; represents oxygen or sulfur atom and W represents an electron-withdrawing group, and Rand Rrepresent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film

A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein &#x3b4; represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and Rand Rrepresent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Growing community of inventors

Otsu, Japan

Daichi Miyazaki