Mitsubishi Electric Corporation

Dai Yoshii

Masaaki Tanigawa

Masao Akiyoshi

Masaaki Taruya

Ryuichi Ishii

Kazuhiro Tada

Kensuke Takeuchi

Koki Hayakashi

Hantaro Ozawa

Shin Uegaki

Tatsuya Kitagawa

Hisashi Koike

The semiconductor device includes: a semiconductor element including a body portion formed in a plate shape, a protection film provided at an outer periphery on one surface of the body portion, and a metal thin film provided adjacently to an inner side of the protection film on the one surface of the body portion; a metal member joined to a surface of the metal thin film on a side opposite to the body portion, by solder; and a mold resin sealing the semiconductor element and the metal member, wherein the surface of the metal thin film on the side opposite to the body portion has, on at least a part of an outer periphery thereof, a projection portion projecting from the surface of the metal thin film, and the solder is not provided on an outer peripheral side from a top of the projection portion.

Semiconductor device and manufacturing method therefor

The present application provides a semiconductor module and a power conversion device wherein wiring inductance is reduced. The semiconductor module is characterized by including a semiconductor element, a first terminal on which the semiconductor element is mounted, a second terminal disposed in a periphery of the semiconductor element and having a multiple of wiring portions, and a multiple of connection lines extending in multiple directions from an upper face of the semiconductor element and connected to each of the multiple of wiring portions of the second terminal, wherein a free region is provided among the multiple of wiring portions, and the multiple of connection lines and the multiple of wiring portions forming current paths with each of the multiple of connection lines are of the same potential.

Semiconductor module and power conversion device

In this semiconductor device, a positioning protrusion is formed at a side surface of a sealing resin from which one end of a main electrode wire protrudes. Thus, the outer size of the sealing resin can be reduced as compared to a case where a positioning protrusion is formed at the bottom of the sealing resin. In addition, a thickness regulating protrusion is provided with a space from solder. Thus, it is possible to prevent interface separation or crack that would occur starting from a contact part between the thickness regulating protrusion and the solder, whereby the life of a joining part between a semiconductor module and a cooler can be ensured. Accordingly, a semiconductor device having enhanced heat dissipation property and reliability is obtained without increase in the outer size of the semiconductor module.

Semiconductor device with a metal plate

A connector structure that is joined to a housing so as to form the control unit includes a connector main body in which a connector is formed, a terminal including a power supply system and a signal system, and a component mounting portion including at least one of a capacitor and a coil, wherein the component mounting portion is provided parallel to a motor output shaft on the exterior of a motor or the housing, and the at least one of the capacitor and the coil included in the component mounting portion is electrically connected directly to the connector of the connector main body via the terminal.

Control unit and electric power steering device employing control unit

A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.

Growing community of inventors

Tokyo, Japan

Dai Yoshii