Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Dai Yokoyama

Hideaki Watanabe

Shigeki Imafuku

Yosuke Nagasawa

Kiyoshi Imai

Hiromi Kinoshita

Toshiyuki Koyama

Satoshi Matsuoka

Yew Song Danny Ng

Yet Ling Loh

Kazuo Nagae

Kian Hong Lam

Taira Ishii

Jintao Huang

A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction. A length of one feed hook among the plurality of feed hooks is longer than a length of an other feed hook among the plurality of feed hooks, the other feed hook being adjacent to the one feed hook on the rotating shaft side.

Component supply device and component mounting device

A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

Method of mounting component

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

Method of manufacturing component-mounted substrate

A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.

Component mounting device and method of mounting component

A component mounting apparatus for mounting a component on a substrate includes a pair of chuck claws that sandwich and grip the component; and adapters that are detachably mounted on the chuck claws and grip the component in place of the chuck claws. The adapters are mounted on the chuck claws in accordance with the component that is an object to be mounted and the component is gripped by using the adapters.

Component mounting apparatus

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Electronic component mounting method and electronic component mounting apparatus

A component supply device includes a posture maintainer and a pair of cutting members. The posture maintainer includes a pair of grip members, each of which includes a tip end portion that extends in a traveling direction of a component holding tape. The posture maintainer maintains the posture of a component by gripping a body portion of the component having been supplied to a component supply position with the body portion interposed between the tip end portions of the pair of the grip members. The pair of cutting members cuts a lead portion of the component having been gripped by the pair of grip members with the lead portion interposed between the pair of cutting members in a direction intersecting a traveling direction of the component holding tape.

Component supply device, component mounter, and component-mounted board manufacturing method

There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage.

Electronic component mounter

This invention relates to an electronic component mounting apparatus. In the apparatus, a rotary body for changing the direction of a component mounting section is fixed to a hollow rotary shaft with a flange. The hollow rotary shaft is provided in a hollow motor and rotated integrally with the rotary body by driving of the hollow motor. A wire extending from an electric component, which is provided in the rotary body for changing the direction of the component mounting section, is arranged in the hollow rotary shaft of the hollow motor. An end of the wire is fixed to the rotary body, and the wire is arranged with looseness or into a spiral in the hollow rotary shaft. Further a lateral surface of inside the hollow rotary shaft and a surface of a coupling shaft are coated with protective materials.

Electronic component mounting apparatus

An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.

Apparatus for mounting a wire component

An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.

Axial-type electronic component inserting apparatus

In a method of inserting, into a board, axial-type electronic components, wherein each of the electronic components has a pair of lead wires extending from a main body and belongs to an assembly of electronic components connected by a tape as arranged at regular intervals, the components are grasped with a plurality of chucks which are intermittently moved to a component supplying position and a component transferring position, respectively. Each of these chucks comprises grasping pieces having first and second grasping grooves, the first grasping grooves having inner surfaces for grasping end portions of each of a first kind of the components whose taped portions are of a first tape interval, the second grasping grooves having inner surfaces for grasping end portions of each of a second kind of the components whose taped portions are of a second tape interval smaller than the first tape interval, the second grasping grooves being slightly deeper than the first grasping grooves. The method includes a first process for taking out one of the components from a component supplying device while preventing the second grasping grooves from contacting the lead wires of the component when the lead wires of the component are grasped by the first grasping grooves when the component grasped by the chuck is the first kind of the component, and a component delivering process.

Axial-type electronic component inserting method

The apparatus includes a light source section, a recognizing section, a moving device, and an operating section. The light source section is disposed transversely of a board so as to illuminate one side of the board. The recognizing section includes lenses, which are disposed transversely of the board so as to face the board from an opposite side relative to the light source section. The recognizing section also includes line image sensors disposed transversely of the board for receiving light rays from the lenses. The moving device is operable to move both the light source section and the recognizing section without changing the relative positions of these sections but moves them in such a way as to change their respective positions relative to the board. The operating section is operable to calculate image data for the entire board from image information obtained by the recognizing section and from position information obtained by the moving device.

Board recognizing apparatus and method

The present invention intends to make the time as long as possible during which a XY table which is interlocked to avoid the contact of an insert guide section and an anvil section moves for positioning thereof. For this purpose, the height of an electronic part mounted onto a substrate in the preceding step and electronic parts to be successively mounted are compared with the distance of an insert head section and the anvil section from the substrate, and such an interlock height as to prevent the mounted electronic parts from coming into contact with said insert head section or said anvil section is maintained and updated in accordance with the height of the highest electronic part among the mounted ones, thereby moving the XY table.

Electronic parts mounting method

Insertion guides are mounted to slide blocks supported by a guide to be close to or away from each other. The slide blocks are meshed with nut parts of a ball screw threaded in both directions. When the ball screw is rotated via a driving pulley, a belt, and a driven pulley by a rotating/driving device set in an insertion head, the slide blocks and insertion guides mounted to the slide blocks are moved, so that an insertion pitch is changed. When the insertion head is rotated by a rotating/driving device via a driving pulley, a belt, and a driven pulley, an insertion direction is changed as well.

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Yamanashi, Japan

Dai Yokoyama