Hitachi Chemical Dupont Microsystems, Ltd.

Dai Kawasaki

Takumi Ueno

Tomonori Minegishi

Masayuki Ooe

Keiko Suzuki

Hiroshi Komatsu

Yoshiko Tsumaru

Noriyuki Yamazaki

Taku Konno

Rika Nogita

Kouji Katou

Hajime Nakano

Nori Sasaki

Nagatoshi Fujieda

Yoshiko Futagawa

Yoshika Satou

A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and Rand Reach independently represents fluoroalkyl group having 1 to 3 carbon atoms.

Photosensitive polymer composition, method of producing pattern and electronic parts

A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B). 

Photosensitive resin composition and circuit formation substrate using the same

A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, Rrepresents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.

Positive-type photosensitive resin composition, method for producing patterns, and electronic parts

A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein Ris a trivalent or tetravalent organic group, Ris a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by OM(Mrepresents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.

Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin composition

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Ibaraki, Japan

Dai Kawasaki