Semes Co., Ltd.

Dai Geon Yoon

Dong Hwa Lee

Dae Sung Kim

Soo Hong Lee

Ji Hyeon Kim

Bong Man Choi

Hyeong Jun Cho

Jong Suk Won

An ink treatment apparatus and method are provided. The ink treatment apparatus includes: a reservoir storing ink; a head module ejecting the ink; a first control valve controlling a flow of the ink; a plurality of fluid transfer lines installed between the reservoir and the head module and having the ink flow therein; a pump installed in the fluid transfer lines to pump the ink; a flow rate measurement module installed in the fluid transfer line, the flow rate measurement module measuring a flow rate of the ink in accordance with the flow of the ink and providing ink flow rate information that is information regarding the flow rate of the ink; and a control module controlling a circulation ratio of the ink between the fluid transfer lines by controlling the pump and the first control valve based on the ink flow rate information.

Ink treatment apparatus and method

Provided are a substrate treating liquid supply unit for constantly maintaining a liquid level of a nozzle of an inkjet head unit through real-time water level measurement, and a substrate treating apparatus including the same. The substrate treating liquid supply unit includes: a first reservoir connected to an inkjet head unit for jetting a substrate treating liquid onto a substrate and providing the substrate treating liquid to the inkjet head unit; a water level sensor measuring a water level of the substrate treating liquid stored in the first reservoir; and a pressure control module compensating for a pressure provided to the first reservoir based on an amount variation in the water level of the substrate treating liquid, wherein a liquid level of a nozzle of the inkjet head unit is constantly maintained.

Substrate treating liquid supply unit and substrate treating apparatus including the same

Provided is a pressure control device for stably controlling the internal air pressure of a reservoir. The pressure control device includes: an input terminal receiving source air pressure; an intake valve connected between the input terminal and an output terminal; an exhaust valve connected to the output terminal; a pressure sensor connected to the output terminal and generating a sensed value by sensing pressure at the output terminal; and a controller simultaneously operating the intake valve and the exhaust valve by simultaneously operating a first control loop for adjusting the degree of opening of the intake valve by comparing the sensed value with a first target value and a second control loop for adjusting the degree of opening of the exhaust valve by comparing the sensed value with a second target value.

Pressure control device and substrate treatment apparatus including the same

A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

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Chungcheongnam-do, South Korea

Dai Geon Yoon