Samsung Electronics Co., Ltd.

Korea Advanced Institute of Science and Technology

Dahm Yu

Jaehyun Kim

Hyunmin Kwon

Sung Jin Kim

Min Woo Kim

Jae-hyun Kim

Jae Hyun Kim

Sangjun Lee

Jonghyun Lim

Gilho Lee

Sung Ok Kim

Seonmi Lee

Seon-Mi Lee

Ja-Hwan Ku

Ho Gyung Kim

A semiconductor package test apparatus is provided. A semiconductor package test apparatus comprises a test board including a plurality of sensors, a chamber into which the test board is loaded, and a controller configured to control a temperature of the chamber, wherein the controller adjusts the temperature using the plurality of sensors.

Semiconductor package test apparatus and method

An apparatus for testing an object may include a test chamber, a first chamber, a second chamber, and a gas supply module. The test chamber receives a test board for testing an object. The first chamber is under the test chamber and receives a lower surface of the test board. The second chamber surrounds the first chamber to isolate the first chamber from ambient air. The gas supply module supplies a dry gas to the second chamber to provide a positive pressure higher than an ambient pressure, thereby preventing the ambient air from infiltrating into the first chamber. Thus, during the testing of the object at a low temperature, the second chamber may prevent the humid ambient air from infiltrating into the first chamber to prevent condensation of water on the lower surface of the test board.

Apparatus and method of testing an object within a dry gas environment

A test apparatus and an automatic test equipment having the same are disclosed. The test apparatus includes a test head having a test area, a socket board combined to the test area of the test, the socket board including a socket body and an active device attached on a first surface of the socket body, the active device configured to operate a semiconductor package, and a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board.

Test apparatus for testing semiconductor packages and automatic test equipment having the same

Disclosed are a test chamber and a test apparatus having the same. The test chamber includes a test compartment configured to support a plurality of test boards, each being configured to secure a test object. The test chamber applies a test signal to the test object. The test chamber includes an inlet side and a discharge side, and a supply duct vertically extending along a height of the test compartment. The supply duct supplies the inlet side of the test compartment with the test fluid. The test chamber includes a fluid controller to uniformly control a distribution of a test fluid in the supply duct and uniformly supply the test compartment with the test fluid. The disclosed test chamber and test apparatus provide a uniform test temperature and thereby improve a test reliability of a test object such as a semiconductor or semiconductor package.

Test chamber and test apparatus having the same

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Daejeon, South Korea

Dahm Yu