Samsung Electronics Co., Ltd.

Dahee Kim

Yeonggyu Yoon

Wonkyu Sung

Soohyun Seo

Sukdong Kim

Changhan Lee

Gookmi Song

Hyunju Hong

Jookwan Lee

Jooyoung Kang

Jihea Park

Hyoungtak Cho

Sangeun Lee

Moonjeong Kim

Raetae Kim

Moonsun Kim

Taehoon Lee

Gyeongtae Park

Wankyu Kim

Jonghwa Lee

Jaeean Lee

Byungwoo Min

Songyi Lee

Sunghwan Park

Jeongrim Seo

A semiconductor package includes a first substrate having a first surface and a second surface, and having a cavity extending from the first surface to the second surface in a vertical direction, a first chip disposed in the cavity of the first substrate, a redistribution structure on the first surface of the first substrate, a second chip on the redistribution structure, a third chip spaced apart from the second chip in a horizontal direction and disposed on the redistribution structure, and a bridge chip embedded in the redistribution structure, wherein the redistribution structure includes a first redistribution pattern, a second redistribution pattern, and a third redistribution pattern.

Semiconductor package

An electronic device is provided. The electronic device includes a first housing, a second housing slidably coupled to the first housing, a display of which at least a part is fixed to the second housing so that an information display region, which is a part of the electronic device visible on the outside, increases or decreases according to the sliding of the second housing, and a support member including a bendable structure, supporting at least a part of the display, and moving according to the sliding of the second housing, wherein, the information display region increases if the second housing slides in a first direction at a reference position at which the end of the second housing and the end of the first housing are substantially aligned, and the information display region decreases if the second housing slides in a second direction opposite to the first direction at the reference position.

Electronic device including rollable or slidable display

A semiconductor package includes a semiconductor chip including a connecting pad, a mold layer covering the semiconductor chip, a lower redistribution layer on the semiconductor chip and the mold layer, and a connecting terminal on the lower redistribution layer. The lower redistribution layer includes a first lower insulating layer, a first conformal redistribution pattern extending through the first lower insulating layer, a second lower insulating layer on the first lower insulating layer and the first conformal redistribution pattern, and a first filled redistribution pattern disposed on the first conformal redistribution pattern and extending through the second lower insulating layer. A side surface of the first filled redistribution pattern is spaced apart from an inner side surface of the first conformal redistribution pattern. The second lower insulating layer is between the inner side surface of the first conformal redistribution pattern and the side surface of the first filled redistribution pattern.

Semiconductor package including redistribution pattern

An electronic device and its screen control method are disclosed. The electronic device may include a flexible display configured to change a size of a display area and at least one processor. The at least one processor may, based on a first screen being displayed in the display area of a first size, receive an input for changing the display area into a second size The at least one processor may, based on the display area being changed to the second size according to the received input, control the display to display a second screen which changes the first screen in response to the second size in the display area changed into the second size. The second screen may include, among a plurality of elements in content, a first element corresponding to an element in the first screen and a second element of the content.

Electronic device having flexible display with variable size and reference position and screen control method thereof

An example electronic device may include a housing, a flexible display, wherein at least a portion of the flexible display which is positioned in the housing is configured to be exposed to an outside of the housing as the housing slides, a speaker, and a processor operatively connected with the speaker and the flexible display. The processor may be configured to control the speaker to output a first sound at a first volume value while a state of the housing is a normal state, identify a size of a first area of the flexible display exposed to the outside, based on a first slide of the housing to change the state of the housing to an extended state, and control the speaker to output the first sound at a second volume value higher than the first volume value based on a size of the first area while the state of the housing is the extended state.

Electronic device including flexible display and method for operating the same

An electronic device is provided. The electronic device includes a display including a main area, a first sub area extending in a first direction, and a second sub area extending in a second direction perpendicular to the first direction, a display driver integrated circuit (IC) for scanning a scan signal and a data voltage to the display, and a processor operatively connected to the display and the display driver IC, wherein the processor is configured to control the display driver IC to supply the scan signal to at least some areas among the main area, the first sub area, and the second sub area of the display, to control the display driver IC to partially scan a data voltage to an area in which a screen is to be displayed among the main area, the first sub area, and the second sub area.

Electronic device including display having plurality of states and method for controlling same

A semiconductor package includes: a redistribution substrate including a connection via and a redistribution layer electrically connected to each other, and a redistribution pad electrically connected to the redistribution layer by the connection via, a space pattern separating at least some of the redistribution pads from each other, a dummy metal pattern at least partially surrounded by the space pattern, and a degassing opening passing through at least one of the redistribution pad and the dummy metal pattern; a connection bump electrically connected to the redistribution pad; and a semiconductor chip on the redistribution substrate and including a connection pad electrically connected to the redistribution layer, the redistribution pad including a plurality of protrusions protruding from the same plane in directions different from each other and having a corner having a rounded shape, and the dummy metal pattern includes branch patterns each extending in directions different from one another.

Growing community of inventors

Suwon-si, South Korea

Dahee Kim