Lg Electronics Inc.

Dmc Co., Ltd.

Daeyong Seong

Jaehun Kim

Juyoung Choi

Chaemoon Lee

Donghwi Son

Kiho Kang

Sihyun Sung

Jihoon Hwang

Seonwook Bang

Byoungnam Kim

Dongkyun Ko

Namsu Rho

Woojoon Roh

Dongeon Kim

According to an embodiment of the present disclosure, a refrigerant pipe fitting, the fitting having a pipe shape with a hollow to connect a pipe, may include an out pipe opening which is opened at one end of the fitting and into which an out pipe is inserted; an inner pipe opening which is opened at the other end of the fitting and into which an inner pipe is inserted to be inserted into the out pipe inside the fitting; a pressing portion which is configured to form a part of an inner surface of the fitting and formed to have a narrower inner diameter as it extends toward the inner pipe opening to press and deform the out pipe to allow the out pipe to connect with the inner pipe in movement of the fitting; and a fastening portion which is formed on the inner surface of the fitting between the pressing portion and the out pipe opening to constrain an end of the out pipe to prevent the fitting from being separated.

Refrigerant pipe fitting and refrigerant pipe fitting method using thereof

A device for inspecting waterproofness of an object includes a lower jig and an upper jig configured to support the object to be inspected, inspection modules configured to contact an outer surface of the object, and an air compressor configured to supply air to the inspection modules. Each of the inspection modules includes a jig that is configured to contact the outer surface of the object and defines a chamber configured to communicate air, a valve defining a passage in communication with the chamber, an air supply line connecting the valve to the air compressor and configured to guide air to the passage, and a pressure sensor connected to the valve and configured to detect an air pressure in the passage.

Device for inspecting waterproofness

Provided are an antenna module for 5G communication, a manufacturing method thereof, and an electronic device including the antenna module. The antenna module includes an antenna body having a space formed therein, a plated layer plated on an inner surface of the antenna body, and a pore member formed on an outer surface of the antenna body and having an dielectric constant lower than that of the antenna body, wherein a thickness of the antenna body is smaller than a thickness of the pore member.

Antenna module, manufacturing method thereof, and electronic device including the antenna module

Growing community of inventors

Seoul, South Korea

Daeyong Seong