Samsung Display Co., Ltd.

Daehwan Jang

Kikyung Youk

Sangduk Lee

Hyun A Lee

Seung-Won Park

Gugrae Jo

Chan-Jae Park

Dae-Young Lee

Seokhyun Nam

Taewoo Kim

Yunjong Yeo

Hyungbin Cho

Jin Ho Cho

Haengwon Park

Sunghoon Kim

Eunjung Kim

Jung Gun Nam

Lei Xie

Heeju Woo

Hyuk-hwan Kim

Takakuwa Atsushi

Sang-Hoon Lee

Sanghoon Lee

Yong-Hwan Ryu

Sungwon Cho

Jonghyeon Choi

Chan-jae Park

Jaebeen Lee

Hyunju Kang

Moonjung An

Il Hyun Yang

Sunok Oh

Sung-Young Choi

SungWon Kim

Jihun Kim

Baehyoun Jung

Incheol Jeong

A display device includes a display panel, a mold frame, and graphite sheets. The mold frame includes a mold slot portion therethrough to support the display panel. The graphite sheets include a central portion on a rear surface of the display panel, and end portions passing through the mold slot portion to be on the rear surface of the mold frame. The graphite sheet is rolled and arranged in a mounting space between the display panel and a back cover, such that heat generated from the display panel may be dissipated to the outside via the graphite sheet and the back cover.

Display device including graphite sheets penetrating mold slot portions for enhanced heat dissipation

A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.

Display device and manufacturing method thereof

A display device includes an electronic component comprising a bump, which includes a first bump portion and a second bump portion that has a surface area less than that of the first bump portion on a plane to surround the first bump portion, a display panel facing the electronic component and including a signal pad that is in contact with the bump, and an adhesive member which is disposed between the display panel and the electronic component and in which an opening overlapping the first bump portion on the plane is defined, wherein the bump is in contact with the signal pad through the opening.

Adhesive member and display device comprising adhesive member and method for manufacturing

A display panel includes a pad line disposed on a rear surface of a base layer and a connection line disposed on a front surface of the base layer. The pad line and the connection line are connected in an area overlapping a pad hole defined to pass through the base layer, and the pad line is connected to a driving unit on the rear surface of the base layer.

Display panel with pad hole

Display device having heat dissipation layers in substrate opening and insulation layer opening

A stamp for nano imprinting includes a base substrate, a first pattern part and a second pattern part disposed on the base substrate and having different widths, and a third pattern part and a fourth pattern part having different widths. Each of the first pattern part to the fourth pattern part includes a plurality of nano patterns, and the first pattern part and the second pattern part and the third pattern part and the fourth pattern are disposed to be arranged adjacent to each other in a sequential order in the first direction.

Master stamp for nano imprint and method for manufacturing the same

An adhesive member is between an electronic component and an electronic panel that are connected to each other through the adhesive member. The adhesive member has a second surface and a first surface. The adhesive member includes a first recess pattern recessed from the first surface and a second recess pattern recessed from the first surface. The second recess pattern is spaced apart in a first direction from the first recess pattern. A sum of a planar area of the first recess pattern and a planar area of the second recess pattern ranges from about 20 percent (%) to about 70% of a planar area of the first surface.

Adhesive member, display device including the same, and method of fabricating display device

A display device includes a display panel including a display area and a non-display area defined therein and including a plurality of signal pads overlapping the non-display area, an electronic component including a base layer with an upper surface and a lower surface, a plurality of driving pads disposed on the lower surface of the base layer, and a plurality of driving bumps respectively disposed on the plurality of driving pads, the plurality of driving bumps being respectively connected to the signal pads, and a filler disposed between the display panel and the electronic component. A first hole is defined in the upper surface of the base layer, and the first hole does not overlap the plurality of driving bumps in a plan view.

Display device and method of manufacturing the same

A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.

Method for manufacturing display device

An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.

Ultrasonic bonding apparatus and ultrasonic bonding method using the same

A method of manufacturing a roll type imprint master mold including disposing a base layer on a substrate including a first area and a second area adjacent to the first area, disposing an inorganic insulation layer on the base layer, forming a first mask pattern and a first resin pattern in the first area, forming a pattern layer by etching the inorganic insulation layer using the first resin and the first mask patterns as a mask, removing the first resin and the first mask patterns, forming a second mask pattern and a second resin pattern in the second area, forming a pattern layer by etching the inorganic insulation layer using the second resin and the second mask patterns as a mask, removing the second resin and the second mask patterns, separating the base layer from the substrate, and attaching the base layer onto a roll body.

Roll type imprint master mold, method of manufacturing the same, and imprint method using the same

A wire grid polarizer includes a base substrate, a wire grid pattern, a first stitch line extending in a first direction, and a second stitch line extending in a second direction which crosses the first direction, and including a first portion and a second portion which are discontinuous from each other, in which the wire grid pattern is evenly formed on all of the base substrate except where the first and second stitch lines exist, and the first and second stitch lines are where the wire grid pattern is unevenly formed.

Imprint lithography method, master template for imprint, wire grid polarizer manufactured using the master template and display substrate having the same

A method of manufacturing an imprint master template including forming a first layer pattern only in a partial region and a second layer formed in the entire region, and then a back exposure process is performed.

Method of manufacturing imprint master template

An imprint lithography method includes forming a first imprint pattern on a substrate in a first area and a third area, wherein the third area is spaced apart from the first area, forming a first resist pattern on the substrate on a second area, wherein the second area is adjacent the first and third areas, forming a first pattern in the first and third areas by etching an element under the first imprint pattern using the first imprint pattern and the first resist pattern as an etch barrier, forming a second imprint pattern on the substrate in a second area, forming a second resist pattern on the substrate on the first area and the third area, and forming a second pattern in the second area by etching an element under the second imprint pattern using the second imprint pattern and the second resist pattern as an etch barrier.

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Seoul, South Korea

Daehwan Jang