Samsung Display Co., Ltd.

Daeho Yang

Sunkwan Kim

Seungjun Lee

Sunghoon Lee

Jun-Hee Lee

Taeyoung Park

Seungjoo Lee

Jun Hwan Choi

Sung-Shin Kwak

Ilsoo Jang

Sang-hoon Back

Jongdae Kim

Myung-gil Choi

A peeling device includes a peeling tank for containing a first solution therein, a support portion on which a stack structure including a base layer extending in a first direction and a film coupled with the base layer is disposed, the support portion being disposed in the peeling tank and an adsorption device for adsorbing the base layer thereon to peel off the base layer from the film, the adsorption device including an adsorption portion for adsorbing the base layer, and a moving portion coupled with the adsorption portion for moving the adsorption portion to allow the base layer to be bent to a second direction crossing the first direction and to be peeled off from the film.

Peeling device and peeling method using the same

A glass stack structure includes: a carrier plate having a width in a first direction and a length in a second direction; a stack glass on the carrier plate and including mother glasses sequentially stacked therein; adhesive lines including a high viscous material and arranged at peripheral portions of the carrier plate and the mother glasses to adhere the carrier plate to the mother glasses, and the adhesive lines includes wave lines extending in the second direction and spaced apart from each other in the first direction and linear lines extending in the first direction and spaced apart from each other in the second direction; and an adhesive layer including a low viscous material and covering a cell area of the carrier plate and the mother glasses to adhere the carrier plate to the mother glasses, where the cell area is defined by the wave lines and the linear lines.

Glass stack structure for forming a flexbile glass and method of manufacturing the same

Provided is a method for manufacturing an electronic device. The method includes providing a panel to a stage, providing a circuit board, aligning the circuit board so that first pads of the circuit board face a first pad area of the panel and second pads of the circuit board face a second pad area of the panel, and compressing a first portion of the circuit board on which the first pads are arranged to the first pad area of the panel. The aligning of the circuit board occurs via by external contact on one surface of the first portion of the circuit board and one surface of the second portion of the circuit board.

Method of manufacturing electronic device

Growing community of inventors

Asan-si, South Korea

Daeho Yang