Samsung Electro-mechanics Co., Ltd.

Samsung Led Co., Ltd.

Samsung Electronics Co., Ltd.

Dae Yeon Kim

Hun Joo Hahm

Young Sam Park

Hyung Suk Kim

Seong Yeon Han

Do Hun Kim

Dae Hyun Kim

Jae Ho Shin

Chang Ho Shin

Seon Goo Lee

Young June Jeong

Kyung Taeg Han

Chang Ho Song

Jung Park

Dong Hyun Cho

Ho Sik Ahn

Chul Hee Yoo

Jung Ho Kim

Su Yeol Lee

Young Jae Song

Sang Ho Yoon

Baek Youn

Jun Hyoun Kwon

Seong Ryeol Myeong

In Tae Yeo

Yoon Sung Na

Gwan Taek Kim

Mu Jung Kim

Tae Wi Kim

Jae Hong Shin

Disclosed are an air conditioner and a control method therefor. The air conditioner includes: a main body; a filter configured to filter impurities externally introduced into the main body; a fan configured to introduce the impurities into the main body through the filter; a sensor configured to detect a filter state value for determining a state of the filter; and a processor configured to determine that a replacement time of the filter arrives when an impurity purification capacity calculated on the basis of the filter state value detected in real time by the sensor is lower than a reference value.

Air conditioner and control method therefor

Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.

Backlight unit

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

Light emitting diode package and fabrication method thereof

There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.

Light emitting module

The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.

Light emitting diode package including a lead frame with a cavity

The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

LED package and backlight unit using the same

There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.

Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same

A backlight unit for a liquid crystal display (LCD) device, disposed under a liquid crystal panel to illuminate the liquid crystal panel. The backlight unit includes a light guide plate, first and second light emitting diode (LED) arrays, disposed on adjacent sides, perpendicular to each other, of the light guide plate, each array having a plurality of LED blocks, consisting of one or more LEDs, and a control unit that controls electric signals, respectively inputted to the LED blocks, to regulate luminance for the respective LED blocks, wherein light emitted from the first and second LED arrays is overlapped each other in the light guide plate.

Backlight unit implementing local dimming for liquid crystal display device

A polarized semiconductor light emitting device includes a semiconductor structure having a first conductivity semiconductor layer, an active layer and a second conductivity semiconductor layer sequentially stacked. Also, the semiconductor structure further includes a plurality of light guide parts defined by a plurality of grooves arranged along a predetermined direction. The grooves extend from the second conductivity semiconductor layer with a depth reaching at least the active layer, and the light guide parts have a length greater than a width thereof to selectively emit a polarized component in a length direction thereof.

Polarized semiconductor light emitting device with light guiding portions formed within

Growing community of inventors

Kyungki-do, South Korea

Dae Yeon Kim