Koh Young Technology Inc.

Dae Sung Koo

Yong Hwan Kim

Yong Kim

Yong Sam Kim

Woo Young Lim

Ki Won Park

Filip Lukasz Piekniewski

Jin Man Kang

Seung Bum Han

Seo Jeong Jang

A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.

Method for inspecting insertion states of plurality of pins included in connector inserted into substrate, and substrate inspection apparatus

An apparatus for inspecting components may include a processor for: determining exterior information of a first component mounted on a first printed circuit board; inspecting a mounting state of the first component by using inspection information of a second component having a first similarity value, when the first similarity value is higher than or equal to a preset reference similarity value, and updating the inspection information of the plurality of components by using the inspection information of the first component matched with the inspection information of the second component, when it is determined that the mounting state of the first component is good.

Apparatus for inspecting components mounted on printed circuit board, operating method thereof, and computer-readable recording medium

According to the disclosure, an inspection apparatus determines whether a defect has occurred in a plurality of first inspection objects by comparing a reference range with the measurement value of the plurality of first inspection objects, identifies a plurality of second inspection objects in which a first error has occurred, and a plurality of third inspection objects in which a second error has occurred based on a result of determination whether the defect has occurred, adjusts the reference range based on measurement values of the plurality of second and third inspection objects, determines at least one of an occurrence probability of the first error and the second error based on the adjusted reference range, and displays at least one of a graph indicating the result of determination whether the defect has occurred, the adjusted reference range, the determined occurrence probability of the first error and the second error.

Inspection apparatus and operating method thereof

A substrate inspection apparatus may include a communication circuit, a plurality of light sources, an image sensor, at least one memory, and at least one processor. The processor may be configured to generate pin insertion state information indicating an insertion state of each of a plurality of first pins by using a pattern light reflected from each of the plurality of first pins, detect at least one second pin having an insertion defect from among the plurality of first pins by using at least one of the pin insertion reference information and the pin insertion state information of each of the plurality of first pins, generate a control signal for adjusting at least one first process parameter among a plurality of process parameters of the pin insertion apparatus, and control the communication circuit to transmit the control signal to the pin insertion apparatus.

Method for inspecting insertion states of pins inserted into substrate, and substrate inspection apparatus

A method for adjusting a condition for determining a quality of an inspection object comprises: acquiring measurement values for the structures of a plurality of inspection objects; determining whether each of the plurality of inspection objects is good or defective by comparing error values of the measurement values with respect to design values with a predetermined reference value; identifying one or more inspection objects in which determination error has occurred among the plurality of inspection objects; generating and outputting an inspection result graph including the number of inspection objects according to the error values, the reference value, and the number of the one or more inspection objects in which the determination error has occurred; updating the reference value according to a graphical input; and redetermining whether each of the plurality of inspection objects is good or defective by comparing the error values with the updated reference value.

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Seoul, South Korea

Dae Sung Koo