Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Dae Kwon Jung

Yong Ho Baek

Young Sik Hur

Doo Il Kim

Bang Chul Ko

Won Wook So

Yun Tae Lee

Ho Kwon Yoon

Woo Jung Choi

Seung Eun Lee

Jung Hyun Cho

Chul Jun Choi

Jung Sun Kwon

Joo Hwan Jung

Sung Youl Choi

An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.

Antenna module

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.

A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound, and a position sensor configured to identify a position of the terminal; a processor configured to learn the position of the terminal and the surrounding sound to identify characteristics of a dangerous sound depending on the position of the terminal, and determine a setting value of a hearing aid depending on the identified characteristics of the dangerous sound; and a communicator configured to transmit the setting value to the hearing aid.

Terminal with hearing aid setting, and method of setting hearing aid

A terminal may include: a sensor unit including a microphone configured to acquire a surrounding sound and a position sensor configured to detect a position of the terminal; a processor configured to identify characteristics of a voice of a specific person designated by a user of the terminal through learning, and determine a setting value determining operating characteristics of a hearing aid based on the characteristics of the voice of the specific person; and a communicator configured to transmit the setting value to the hearing aid.

Terminal with hearing aid setting, and setting method for hearing aid

The present disclosure relates to an image sensor device including: a fan-out semiconductor package including a first semiconductor chip having an active surface on which a connection pad is disposed, a first connection member disposed on the active surface and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, and a sealing material disposed on the first connection member and sealing at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the first connection member and electrically connected to the first connection member; and a third semiconductor chip disposed on the second semiconductor chip and electrically connected to the second semiconductor chip, in which at least one of the second semiconductor chip or the third semiconductor chip may be an image sensor. The present disclosure also relates to an image sensor module including the image sensor device.

Image sensor device and image sensor module comprising the same

Growing community of inventors

Suwon-si, South Korea

Dae Kwon Jung