Samsung Electro-mechanics Co., Ltd.

Dae Jo Hong

Chang Sup Ryu

Cheol Ho Choi

Chang Bo Lee

Hyo Seung Nam

The present invention provides a composition for developing a photoresist containing a carboxyl group (&#x2014;COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.

Composition for photoresist development and method of developing photoresist using the same

Disclosed herein is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes: preparing a base substrate having first connection pads and second connection pads; forming a solder resist layer on the base substrate, the solder resist layer having a first opening for exposing the first connection pads; forming a first surface treatment layer on the first connection pads; forming a protective film on the solder resist layer; forming a second opening for exposing the second connection pads in the protective film and the solder resist layer; and forming a second surface treatment layer on the second connection pads.

Method for manufacturing printed circuit board

Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.

Printed circuit board and method of manufacturing the same

Disclosed is a method for forming post bumps, the method including the steps of: forming a seed layer for metal plating on a substrate; forming a resist layer having openings provided as positions where the seed layer is subjected to metal plating; forming a dummy sheet, exposing the openings, on the resist layer; forming a post by performing metal plating of the openings; forming solder balls on the post; and removing the dummy sheet and the resist layer.

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Gyunggi-do, South Korea

Dae Jo Hong