Samsung Electro-mechanics Co., Ltd.

Dae Jin Shim

Eun Jung Lee

Jong Ho Lee

Sim Chung Kang

Jung Jin Park

Hyun Sik Chae

Dong Jun Jung

Ji Eun Park

Sun Mi Kim

Hye Yun Jeong

Su Min Kim

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction; external electrodes disposed on the body; and side margin portions disposed on the body, wherein an average content of Sn included in the side margin portion is 0.1 mol % or more and 4.0 mol % or less, wherein a Ba/Ti ratio of the side margin portion is greater than 1.040 and less than 1.070, and wherein an average size of a plurality of dielectric grains included in the side margin portion satisfies 100 nm or more and 290 nm or less.

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and internal electrodes, and including first and second surfaces, third and fourth surfaces, fifth and sixth surfaces, external electrodes disposed on the third and fourth surfaces, and side margin portions disposed on the fifth and sixth surfaces. The side margin portions include a first region adjacent to the internal electrodes and a second region adjacent to outside of the side margin portions. In a Raman spectra obtained by analyzing one point located in the first and second region respectively, peak X appears in a Raman shift of 450 cmto 600 cm. When a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the first region is λ(cm), a minimum value of the Raman shift at which the peak X appears in the Raman spectra of the second region is λ+0.75 cmor greater.

A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.

Film for manufacturing electronic component

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Suwon-si, South Korea

Dae Jin Shim