Hana Micron Inc.

Silkroad C&t

Dae Jin Kim

Ju Hwan Kim

Kwang Young Park

Yong Ha Jung

Min Jae Lee

Cheol Yong Cha

Young Gil Ju

A method of preparing an admixture for a plasterboard is disclosed. An admixture prepared by the method and a composition for forming a plasterboard containing the admixture are also disclosed. The method includes sulfonation of polystyrene using sulfuric acid to give an admixture including a sulfonated polystyrene (SPS)-based compound of formula 1 below. The admixture enables regulation of properties of a plasterboard, such as foam size, flowability, and setting time, by regulating a degree of sulfonation (DS) of the SPS-based compound:

Preparation method for admixture for plasterboard, admixture prepared thereby, and composition for forming plasterboard comprising same

Provided is a stacked semiconductor package. The stacked semiconductor package of the present invention comprises: a substrate including at least one contact pad; an external chip laminate which includes a plurality of semiconductor chips mounted on the substrate, and which is stacked in multi-steps such that the ends at one side of the plurality of semiconductor chips alternately protrude in opposite directions to expose bonding pads which are formed on the up-face surface; at least one internal chip which is disposed in a mounting space formed between the external chip laminate and substrate so as to be electrically connected to the substrate; and a conductive wire electrically connecting the bonding pad of the semiconductor chip and the contact pad of the substrate.

Stacked seminconductor package

Growing community of inventors

Cheonan-si, South Korea

Dae Jin Kim