Semcns Co., Ltd.

Dae Hyeong Lee

Doo Yun Chung

Yong Seok Choi

A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.

Growing community of inventors

Suwon-si, South Korea

Dae Hyeong Lee