Samsung Electro-mechanics Co., Ltd.

Dae Hyeong Lee

Gyu Man Hwang

Ki Pyo Hong

Myung Whun Chang

Min Cheol Park

Moon Soo Park

Jung Eun Noh

Jeong Ho Yoon

Byeung Gyu Chang

Byung Taek Kim

Yoon Hyuck Choi

Bong Gyun Kim

Yang Ho Moon

Kwang Jae Oh

Jin Waun Kim

Sung Woon Dong

A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted.

Ceramic elements module

There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Method of repairing probe board and probe board using the same

Method of repairing a probe board

There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

Circuit board module and method of manufacturing the same

A method for manufacturing a ceramic elements module. The method includes providing a ceramic elements that has a plurality of lower inserting grooves; mounting an electronic component on a lower surface of the ceramic elements; providing a heat sink that has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted to a lower part of the ceramic elements; coupling the ceramic elements with the heat sink; engaging a fixing member with the lower inserting groove of the ceramic elements by passing through the first penetrating hole of the heat sink; and removing the fixing member.

Method for manufacturing a ceramic elements module

Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

Optimized power package for electrical device

A lens module includes a first lens, a second lens, a spacer, a seating part, and a protrusion part. The first lens includes a lens surface and a rib. The second lens is laminated on the first lens. The spacer maintains a predetermined interval between the first lens and the second lens. The seating part is disposed between the lens surface of the first lens and the rib and allows the spacer to be seated on the upper part of the first lens. The protrusion part includes a plurality of protrusions protruded from an undersurface of the spacer, which allow a height of the spacer seated on the seating part to change when the spacer is decentered.

Lens module

Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.

Growing community of inventors

Seoul, South Korea

Dae Hyeong Lee