Samsung Electronics Co., Ltd.

Dae Hwa Paik

Seung Hyun Lim

Jae Hong Kim

Kyoung Min Koh

Ji Yong Park

Sang Hyun Cho

Min Ho Kwon

Sin Hwan Lim

An image sensor includes a first column line and a second column line configured to extend in a first direction, a plurality of pixel groups configured to connect to the first column line or the second column line and to comprise a plurality of pixels in each of the plurality of pixel groups, a bias circuit configured to comprise a first current circuit and a second current circuit configured to output different bias currents in a first operational mode, and a switching circuit configured to connect the first column line to the first current circuit and connect the second column line to the second current circuit during a first time period, and to connect the first column line to the second current circuit and connect the second column line to the first current circuit during a second time period subsequent to the first time period in the first operational mode.

Image sensor

An image sensor chip includes an internal voltage generator for generating internal voltages using an external voltage received at a first terminal of the image sensor chip, a temperature sensor for generating a temperature voltage, a selection circuit for outputting one of the external voltage, the internal voltages, and the temperature voltage, a digital code generation circuit for generating a digital code using an output voltage of the selection circuit, and a second terminal for outputting the digital code from the image sensor chip.

Image sensor chip that feeds back voltage and temperature information, and an image processing system having the same

Growing community of inventors

Seoul, South Korea

Dae Hwa Paik