Samsung Electronics Co., Ltd.

Dae-hoon Na

Jeong-Don Ihm

Hyun-Jin Kim

Byung-Hoon Jeong

Young-Don Choi

Jang-woo Lee

Seon-Kyoo Lee

Kyoung-Tae Kang

Sang-Lok Kim

A multi-chip package capable of testing internal signal lines including a printed circuit board, a first semiconductor chip mounted on the printed circuit board and including a test circuit, and second semiconductor chips mounted on the printed circuit board and electrically connected to the first semiconductor chip via a plurality of internal signal lines may be provided. The test circuit may be configured to enable circuits of the first semiconductor chip connected to pads contacting the plurality of internal signal lines, transmit complementary data to at least two pads from among the pads, and form a current path in the circuits connected to the at least two pads, thereby detecting a short-circuit between the internal bonding wires.

Multi-chip package capable of testing internal signal lines

An apparatus includes data transmitter having first through N-th data drivers configured to provide first through N-th data signals, respectively, and a strobe driver configured to provide a strobe signal, and a data receiver having a strobe buffer configured to generate a control signal based on the strobe signal, and first through N-th sense amplifiers configured to sense N-bit data based on the control signal, a reference signal and the first through N-th data signals. The bus includes a strobe TSV configured to connect the strobe driver with the strobe buffer, and first through N-th data TSVs configured to connect the first through N-th data drivers with the first through N-th sense amplifiers, respectively. A reference signal supplier controls the reference signal such that a discharge speed of the reference signal is slower than a discharge speed of each of the first through N-th data signals during data transmission.

Apparatus and method of transmitting and receiving data, and semiconductor package including the same

A semiconductor package includes an external electrode, an interface chip, and a semiconductor chip. The interface chip includes an external interface pad bonded to the external electrode, a plurality of internal interface pads, and an interface circuit coupled between the external interface pad and the plurality of internal interface pads. The semiconductor chip includes a signal pad that is selectively bonded to one of the plurality of internal interface pads. The interface circuit activates a connection between a selected pad, which corresponds to a pad that is bonded to the signal pad among the plurality of internal interface pads, and the external interface pad, and deactivates connections between unselected pads, which correspond to pads that are not bonded to the signal pad among the plurality of internal interface pads, and the external interface pad.

Semiconductor packages usable with semiconductor chips having different pad arrangements and electronic devices having the same

A clock signal processor includes a duty cycle corrector, a switch point calculator, and a multiplexer. The duty cycle corrector generates a second clock signal by modifying a duty cycle of a first clock signal. The switch point calculator activates a switch signal at an end of a latency period in which a read command is provided to a non-volatile memory device and an invalid data is read from the non-volatile memory device. The multiplexer outputs one of the first and second clock signals as a third clock signal based on the switch signal.

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Seoul, South Korea

Dae-hoon Na