Samsung Electro-mechanics Co., Ltd.

Dae Heon Jeong

Soo Hwan Son

Ho Yoon Kim

Man Su Byun

Min Kyoung Cheon

Kyung Hwa Yu

Jong Duck Kim

Young Ghyu Ahn

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

Composite electronic component and board having the same

A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.

A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.

Multilayer electronic component and board having the same mounted thereon

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a body having internal electrodes stacked to face each other and a plurality of dielectric layers interposed therebetween, and first and second external electrodes disposed on both end portions of the body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor, wherein the ceramic chip has a double-step shape and includes two ceramic chips having different lengths to each other and coupled in a thickness direction of the ceramic chip.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes and having first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes including first and second connected portions respectively disposed on the third and fourth surfaces of the capacitor body and first and second band portions respectively extending from the first and second connected portions to portions of the first surface of the capacitor body, respectively; a first connection terminal disposed on the first band portion; and a second connection terminal disposed on the second band portion, wherein 0.05&#x2264;A1/A1&#x2264;0.504, where A1 is an area of the first or second connection terminal in a thickness-width direction, and A2 is an area of the first or second band portion in a width-length direction.

Multilayer electronic component and board having the same

The composite electronic component includes: the capacitor including a body in which a plurality of dielectric layers and internal electrodes facing each other, with the dielectric layer interposed therebetween, are stacked, and the ESD protection device including first and second lead electrodes disposed on the body of the capacitor, a discharge part disposed between the first and second lead electrodes, and a protection layer disposed on the first and second lead electrodes and the discharge part; an input terminal connected to the internal electrode of the capacitor and the first lead electrode of the ESD protection device; and a ground terminal connected to the internal electrode of the capacitor and the second lead electrode of the ESD protection device. G2/G1&#x3c;4.0 is satisfied, in which G1 is a distance between the internal electrodes adjacent to each other and G2 is a distance between the first and second lead electrodes.

A composite electronic component includes a multilayer capacitor including a capacitor body, which includes first and second internal electrodes facing each other and a plurality of dielectric layers each interposed therebetween and first and second external electrodes disposed on opposing ends of the capacitor body, a high-rigidity chip including a substrate disposed on a lower side of the multilayer capacitor and first and second discharge electrodes disposed on the substrate and spaced apart from each other, the first and second discharge electrodes being connected to the first and second external electrodes, respectively, and extending to an upper or lower surface of the substrate, and an sealing part covering the first and second discharge electrodes and including a space portion, which is provided between the first and second discharge portions.

Growing community of inventors

Suwon-si, South Korea

Dae Heon Jeong