Lg Innotek Co., Ltd.

Wellmarker Bio Co., Ltd.

Yonsei University

University-industry Cooperation Group of Kyung Hee University

Suzhou Lekin Semiconductor Co., Ltd.

The Asan Foundation

Meet Co., Ltd.

Duckjin Co., Ltd.

Neumed Inc.

Onconic Therapeutics Inc.

Dae Hee Lee

Eun Young Lee

Seung Woo Hong

Jae Sik Shin

Jai Hee Moon

Dong Hoon Jin

Seung Mi Kim

Kwang Ki Choi

Young Hoon Kim

Jung Wook Lee

Seul Gee Lee

Sun Woo Park

Dong Hyun Sung

Jae Cheon Han

Byoung Woo Lee

Gun Kyo Lee

Seung Il Lee

Young Kyu Jeong

Yun Min Cho

Jin Hee Jung

Won Seob Shin

Hocheol Kim

Eun Kyung Choi

Jeong Hee Kim

In Yong Park

Jung Hwan Son

Seong Joon Park

Jung Shin Lee

Mi Yeon Kim

Young Min Boo

Seung Hee Ha

Jae Young Im

Joo Ho Moon

Yong Sang Hong

Ji Hyun Koo

Ni Na Ha

Jae Lyun Lee

Dong Soo Baik

Mi Yeong Kim

Kyu Pyo Kim

Hee Taek Lee

Jung Hwan Lee

Bong Choel Kim

Jai Wan Tan

Ga Young Hong

Ha Reum Lee

Eun Kyoung Choi

Ih Yeon Hwang

Soo A Jung

Ho Chol Kim

A protective sheet according to an embodiment includes an optical film layer; and an adhesive layer disposed on one surface of the optical film layer and including a first open region; wherein an outer width of the optical film layer is greater than an outer width of the adhesive layer, wherein a central region of the one surface of the optical film layer is exposed through the first open region of the adhesive layer, and an outer region of the one surface of the optical film layer is exposed by a difference from the outer width of the adhesive layer.

Protective sheet and camera module comprising same

An embodiment provides a semiconductor device comprising: a substrate; a semiconductor structure disposed on the substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an activation layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a bonding layer disposed between the semiconductor structure and the substrate; a cover layer disposed between the bonding layer and the semiconductor structure; and an electrode pad disposed on the cover layer and spaced apart from the semiconductor structure, wherein: the semiconductor structure further comprises a stepped portion at which the lateral surface of the second conductive semiconductor layer, the lateral surface of the activation layer, and the lower surface of the first conductive semiconductor layer are exposed; the stepped portion is disposed at the outer portion of the semiconductor structure; and the cover layer is disposed to extend from a region vertically overlapping the electrode pad to a region vertically overlapping a part of the exposed lower surface of the first conductive semiconductor layer.

Semiconductor device

The present invention relates to a biomarker for predicting susceptibility to an MET inhibitor, and a use thereof, and more specifically, the present invention provides a method for predicting susceptibility to the MET inhibitor. According to the present invention, the present invention has an excellent effect of predicting susceptibility to the MET inhibitor for stomach cancer or lung cancer, and thus the present invention may be usefully employed for treating stomach cancer or lung cancer.

Combination method for treating cancer by targeting immunoglobulin superfamily member 1 (IGSF1) and mesenchymal-epithelial transition factor (MET)

The present disclosure relates to a new biomarker for predicting susceptibility to an EGFR-targeted agent and a use thereof, and more particularly, provides a biomarker for predicting susceptibility to an EGFR (Epidermal Growth Factor Receptor)-targeted agent, comprising a RON (Recepteur d'Origine Nantais) gene; a composition for predicting susceptibility to the EGFR-targeted agent, comprising an agent which measures a gene expression level of the biomarker; or an expression or activity level of a protein thereof; a composition for enhancing the susceptibility to the EGFR-targeted agent, comprising an inhibitor of the expression of the gene or the expression or activity of the protein of the gene as active ingredients; a kit for predicting the susceptibility to the EGFR-targeted agent, comprising the composition; and a method for predicting the susceptibility to the EGFR-targeted agent. According to the present disclosure, since an effect of predicting the susceptibility to the EGFR-targeted agent is excellent in a colon cancer, the present disclosure may be useful in the treatment of the colon cancer.

Biomarker for predicting sensitivity to EGFR-targeting agent, and use thereof

A metal air battery according to one embodiment of the present invention includes a pair of air cathodes having planar shapes respectively, which have a first bonding portion bonded along edges of the pair of the air cathodes and are disposed to face each other; a pair of separators disposed in contact with the pair of the air cathodes; an anode having a planar shape disposed between the pair of the separators and electrically insulated from the pair of the air cathodes; and then a zinc gel disposed in an accommodation space between the pair of the air cathodes. The accommodation space is a space formed by elastic deformation of the pair of the air cathodes.

Metal air battery and method of manufacturing the same

Disclosed according to one embodiment is a light-emitting element comprising: a light-emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a second conductive layer electrically connected to the second semiconductor layer; a first conductive layer which is disposed in a plurality of via holes passing through the light-emitting structure and second conductive layer and comprises a plurality of through electrodes electrically connected to the first semiconductor layer; an insulation layer for electrically insulating the plurality of through electrodes from the active layer, second semiconductor layer, and second conductive layer; and an electrode pad disposed in an exposed area of the second conductive layer, wherein the farther away the second conductive layer disposed between the plurality of through electrodes is from the electrode pad, the greater the width of the second conductive layer becomes.

Light-emitting element

The present invention relates to a method for determining sensitivity to a simultaneous inhibitor against poly ADP ribose polymerase (PARP) and Tankyrase. According to the present invention, a colorectal treatment effect can be maximized by sorting patients having sensitivity to the simultaneous inhibitor against PARP and Tankyrase.

Method for determining sensitivity to simultaneous inhibitor against PARP and Tankyrase

The present invention relates to an electrochemical catalyst structure and a method for producing the same. The electrochemical catalyst structure may include a catalyst layer including a perovskite based oxide as an electrochemical oxygen reduction catalyst; and a modifying layer being in contact with the catalyst layer and including a transition metal oxide capable of chemical interaction with a metal of the perovskite based oxide through electron orbital hybridization.

Electrochemical catalyst structure and method of fabricating the same

A semiconductor device according to an embodiment includes: a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, a second conductive semiconductor layer under the active layer, and a plurality of recesses exposing a lower portion of the first conductive semiconductor layer; at least one pad arranged outside the light emitting structure and arranged to be adjacent to at least one edge; and a plurality of insulation patterns arranged in the recesses and extending to a lower surface of the light emitting structure, in which widths of the plurality of insulation patterns are reduced as the insulation patterns become further away from the pad. The semiconductor device according to the embodiment may prevent a current from being focused on a recess area adjacent to the pad.

Disclosed in an embodiment is a light emitting device comprising: a light-emitting structure having a first semiconductor layer, an active layer under the first semiconductor layer, and a second semiconductor layer under the active layer; a first contact layer disposed under the light-emitting structure; a reflective layer disposed under the first contact layer; a first electrode layer including a capping layer disposed under the reflective layer; a second electrode layer electrically connected with the first semiconductor layer; a protective layer disposed at the outer peripheral portion between the capping layer and the light-emitting structure; a barrier layer at an outer side of the reflective layer and made of a metal different from that of the reflective layer; and a support member disposed under the capping layer.

Light-emitting device and light-emitting device package having same

Disclosed according to one embodiment is a light-emitting element comprising: a light-emitting structure comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a second conductive layer electrically connected to the second semiconductor layer; a first conductive layer comprising a plurality of through electrodes electrically connected to the first semiconductor layer through the second conductive layer and the light-emitting structure; an insulation layer for electrically insulating the plurality of through electrodes from the active layer, the second semiconductor layer, and the second conductive layer; and an electrode pad disposed in an exposed area of the second conductive layer, wherein the plurality of through electrodes differ in the area of a first region electrically connected to the first semiconductor layer.

In one embodiment, a light emitting device comprises a first light emitting part including at least one light emitting cell; a second light emitting part including a plurality of light emitting cells, wherein each of the light emitting cells include a light emitting structure and a first electrode layer disposed under the light emitting structure; a plurality of pads disposed on the light emitting cell of the first light emitting part, wherein the pads are electrically connected to each of the light emitting cells of the first and second light emitting parts; a plurality of connection layers, each connection layer extending from a region under the light emitting cell of the first light emitting part to a region under the plurality of light emitting cells of the second light emitting part; a second electrode layer disposed under the light emitting cells of the first and second light emitting parts; an insulating layer disposed between the first and second electrode layers; and at least one gap part disposed between the at least one light emitting cell of the first light emitting part and the plurality of light emitting cells of the second light emitting part, wherein each of the plurality of connection layers extends through a region under the gap part and is electrically connected to each of the plurality of the light emitting cells of the second light emitting part.

Light emitting device

A light emitting device improves light extraction efficiency and may be individually driven in a light emitting device package and/or a light unit. The light emitting device may include first and second light emitting structures. The light emitting structure may include a first conductive first semiconductor layer, a first active layer under the first conductive first semiconductor layer, and a second conductive second semiconductor under the first active layer. The second light emitting structure may include a first conductive third semiconductor layer, a second active layer under the first conductive third semiconductor layer, and a second conductive fourth semiconductor layer under the second active layer.

Light emitting device, and light emitting device package

Embodiments relate to a light emitting device package including a package body, a light emitting structure disposed on the package body, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, the light emitting structure being divided into at least two light emitting cells, a support substrate located between the package body and the light emitting structure, a first electrode and a second electrode connected to each of the light emitting cells and fluorescent substances disposed respectively on the light emitting cells. At least two layers among the first conductive semiconductor layer, the active layer and the second conductive semiconductor layer included in each of the light emitting cells next to each other are electrically separated from each other.

Light emitting device package and lighting device for vehicle including the same

Litter mat for cat

Growing community of inventors

Seoul, South Korea

Dae Hee Lee